Active matrix electroluminescent display devices, and their manufacture

• US 7,271,409 B2
• Filed: 03/19/2003
• Issued: 09/18/2007
• Est. Priority Date: 03/20/2002
• Status: Expired due to Term

• Current Assignee: Beijing Xiaomi Mobile Software Co., Ltd. (Xiaomi Corp.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Young, Nigel David, Fish, David Andrew, Hector, Jason Roderick, Childs, Mark Johnathan
• Primary Examiner(s): Ha; Nathan W.
• Application Number:
  US10/507,769
• Publication Number:
  US 20050127376A1
• Time in Patent Office: 1,644 Days
• Field of Search: 257/59, 257/72, 257/359
• US Class Current: 257/59
• CPC Class Codes: H10K 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/86 Series electrical configurations of multiple OLEDs

Abstract

Physical barriers (210) are present between neighbouring pixels (200) on a circuit substrate (100) of an active-matrix electroluminescent display device, particularly with LEDs (25) of organic semiconductor materials. The invention forms these barriers (210) with metal or other electrically-conductive material (240) that serves as an interconnection between a first circuit element (21, 4, 5, 6, 140, 150, 160, T1, T2, Tm, Tg, Ch) of the circuit substrate and a second circuit element (400, 400s, 23), for example, a sensor (400s) of a sensor array supported over the pixel array. The conductive barrier material (240) is insulated (40) at the sides of the barriers adjacent to the LEDs and has an un-insulated top connection area (240t) at which the second circuit element is connected to the conductive barrier material (240).

Claims

1. An active-matrix electroluminescent display device comprising:

a circuit substrate on which an array of pixels is present with physical barriers between at least some of the neighboring pixels in at least one direction of the array;

each pixel comprising an electroluminescent element;

the circuit substrate comprising circuitry to which the electroluminescent elements are connected;

the physical barriers comprising conductive barrier material that serves as an interconnection between a first circuit element of the circuit substrate and a second circuit element of the device;

which conductive barrier material is insulated at least at the sides of the barriers adjacent to the electroluminescent elements and has top and bottom connection areas that are un-insulated where the first and second circuit elements are connected to the conductive barrier material.

2. The device according to claim 1, wherein the first circuit element of the circuit substrate is at least one thin film element of a group comprising:

a conductor layer;

an electrode connection;

a supply line;

an addressing line;

a signal line;

a thin film transistor;

a thin film capacitor.

3. The device according to claim 1, wherein the second circuit element is an upper electrode of the electroluminescent element, and the first circuit element is at least one thin film element of the circuit substrate.

4. The device according to claim 3, wherein each pixel comprises side by side sub pixels with the barriers there-between and with the conductive barrier material connecting the upper electrode of one sub pixel to the lower electrode of an adjacent sub pixel, which lower and upper electrodes form the first and second circuit elements.

5. The device according to claim 1, wherein an array of sensors is integrated together with the array of pixels, and the sensors provide the second circuit elements that are connected by the conductive barrier material to the first circuit element of the circuit substrate.

6. The device according to claim 1, wherein an array of sensors is integrated together with the array of pixels, the circuit substrate comprises matrix addressing circuitry for both the array of pixels and the array of sensors, and the conductive barrier material connects sensors of the array to the matrix addressing circuitry.

7. The device according to claim 5, wherein the sensor array is supported on top of the barriers and over the pixel array.

8. The device according to claim 7, wherein a planarizing layer is present over the pixel array with a thickness that extends to the top of the barriers to support the sensor array over the pixel array.

9. The device according to claim 1, wherein insulated lengths of the barriers are predominantly of the conductive barrier material.

10. The device according to claim 1, wherein the barrier comprises a metal core which provides the conductive barrier material that is connected with the first circuit element and that has an insulating coating on at least its sides.

11. The device according to claim 1, wherein the barrier comprises a metal coating which provides the conductive barrier material that is connected with the first circuit element and that has an insulating coating on at least its sides.

12. The device according to claim 1, wherein the physical barrier is predominantly of insulating material through which vias extend for connection with at least one of the first and second circuit elements in the circuit substrate, and wherein a metal coating that provides the conductive barrier material extends on top of the physical barrier and in the vias through the physical barrier.

13. The device according to claim 1, wherein the electroluminescent element is a current driven light-emitting diode of organic semiconductor material.

14. The device according to claim 1, wherein, under the conductive barrier material, connection windows are present in an intermediate insulating layer on the circuit substrate to permit connection to the first circuit element.