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Light emitting device and manufacturing method of the same

  • US 7,271,411 B2
  • Filed: 05/19/2004
  • Issued: 09/18/2007
  • Est. Priority Date: 05/21/2003
  • Status: Expired due to Fees
First Claim
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1. A light emitting device comprising:

  • a substrate;

    a wiring connection portion over the substrate;

    a signal processing circuit over the substrate;

    a first barrier film over the substrate;

    a thin film transistor forming layer formed over the first barrier film;

    a second barrier film formed over the thin film transistor forming layer;

    a wiring forming layer formed over the second barrier film;

    a third barrier film formed over the wiring forming layer;

    a light emitting element forming layer formed over the third barrier film; and

    a fourth barrier film formed over the light emitting element forming layer,wherein the second barrier film is in contact with the first barrier film in a first opening formed in a part of the thin film transistor forming layer;

    wherein the signal processing circuit comprises a thin film transistor;

    wherein the wiring connection portion and at least a part of the signal processing circuit are located beside a same edge of the substrate; and

    wherein the signal processing circuit is formed in the exterior of an area in which the second barrier film is in contact with the first barrier film.

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