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Single package design for 3-axis magnetic sensor

  • US 7,271,586 B2
  • Filed: 12/22/2004
  • Issued: 09/18/2007
  • Est. Priority Date: 12/04/2003
  • Status: Active Grant
First Claim
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1. A sensor package comprising:

  • a rigid substrate, the rigid substrate having a top surface, the top surface including a channel;

    an X-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along an X-axis, the X-axis sensor including input/output pads;

    a Y-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along a Y-axis, the Y-axis sensor including input/output pads;

    a Z-axis sensor attached to the rigid substrate and located in the channel in the top surface of the rigid substrate for sensing magnetic field along a Z-axis, the channel having a width that corresponds to substantially a thickness of the Z-axis sensor, and the Z-axis sensor including input/output pads; and

    corresponding input/output pads located on the top surface of the rigid substrate for conductively connecting to respective input/output pads on each sensor.

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