Single package design for 3-axis magnetic sensor
First Claim
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1. A sensor package comprising:
- a rigid substrate, the rigid substrate having a top surface, the top surface including a channel;
an X-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along an X-axis, the X-axis sensor including input/output pads;
a Y-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along a Y-axis, the Y-axis sensor including input/output pads;
a Z-axis sensor attached to the rigid substrate and located in the channel in the top surface of the rigid substrate for sensing magnetic field along a Z-axis, the channel having a width that corresponds to substantially a thickness of the Z-axis sensor, and the Z-axis sensor including input/output pads; and
corresponding input/output pads located on the top surface of the rigid substrate for conductively connecting to respective input/output pads on each sensor.
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Abstract
A sensor package comprising an X-axis sensor circuit component, a Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate. To minimize the height of the package, a channel is cut out of the top surface of the substrate in order to accommodate the Z-axis sensor component. On the Z-axis sensor component, input/output (I/O) pads are all arranged in an array along one edge of the sensor to conductively cooperate with I/O pads, or solder-filled vias, on the substrate located at a top edge of the channel. Once the sensors have all been mounted to the substrate, the package is encapsulated, and the overall height is less than 1.2 mm.
27 Citations
20 Claims
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1. A sensor package comprising:
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a rigid substrate, the rigid substrate having a top surface, the top surface including a channel; an X-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along an X-axis, the X-axis sensor including input/output pads; a Y-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along a Y-axis, the Y-axis sensor including input/output pads; a Z-axis sensor attached to the rigid substrate and located in the channel in the top surface of the rigid substrate for sensing magnetic field along a Z-axis, the channel having a width that corresponds to substantially a thickness of the Z-axis sensor, and the Z-axis sensor including input/output pads; and corresponding input/output pads located on the top surface of the rigid substrate for conductively connecting to respective input/output pads on each sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A sensor package comprising:
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a rigid substrate, the rigid substrate having a top surface, the top surface including a channel having a width and a depth; an X/Y-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along an X-axis and Y-axis, the X/Y-axis sensor including input/output pads; a Z-axis sensor attached to the rigid substrate and located in the channel in the top surface of the rigid substrate for sensing magnetic field along a Z-axis, the channel having a width that corresponds to substantially a thickness of the Z-axis sensor, and the Z-axis sensor including input/output pads; corresponding input/output pads located on the top surface of the rigid substrate for conductively connecting to respective input/output pads on each sensor; and an encapsulation layer around the package, the height of the package including the encapsulation layer being less than 1.2 mm. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A sensor package comprising:
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a rigid substrate, the rigid substrate having a top surface, the top surface including a channel having a width and a depth; an X-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along an X-axis, the X-axis sensor including input/output pads; a Y-axis sensor attached to the rigid substrate and located on the top surface of the rigid substrate for sensing magnetic field along a Y-axis, the Y-axis sensor including input/output pads; a Z-axis sensor attached to the rigid substrate and located in the channel in the top surface of the rigid substrate for sensing magnetic field along a Z-axis, the channel having a width that corresponds to substantially a thickness of the Z-axis sensor, and the Z-axis sensor including input/output pads; corresponding input/output pads located on the top surface of the rigid substrate for conductively connecting to respective input/output pads on each sensor; and an encapsulation layer around the package, the height of the package including the encapsulation layer being less than 1.2 mm; and wherein the input/output pads on the Z-axis sensor are arranged in a vertical array along one edge of the sensor and conductively communicate with the corresponding input/output pads on the rigid substrate. - View Dependent Claims (15, 16)
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17. A method for manufacturing a sensor package by mounting a Z-axis sensor onto a rigid substrate, the rigid substrate having X- and Y-axis sensors mounted onto a top surface of the substrate, the method comprising:
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cutting a channel out of the top surface of the rigid substrate; forming vias on a top edge of the channel; filling the vias with solder; forming input/output pads along only one edge of the Z-axis sensor; placing bumps of solder on the input/output pads; inserting the Z-axis sensor into the channel with the bumped input/output pads resting on the top surface of the substrate and contacting the solder-filled vias; and encapsulating the package. - View Dependent Claims (18, 19, 20)
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Specification