Method and apparatus for heat sink and card retention

• US 7,272,009 B2
• Filed: 06/02/2005
• Issued: 09/18/2007
• Est. Priority Date: 06/02/2005
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Pav, Darren B., Worley, Richard, Sura, Lisa
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US11/143,164
• Publication Number:
  US 20060274507A1
• Time in Patent Office: 838 Days
• Field of Search: 361/686, 361/687, 361701-710, 361690-692, 361714-719, 361/722, 361/725, 361/728, 361731-734, 361752-754, 361796-802, 361814-818, 174/16.1, 174/16.3, 174/52.1, 174/57, 165/80.2, 165/80.3, 165/185, 165/104.33, 165/165, 257706-712, 257718-727, 248/316.7, 248505-510, 242/95, 242/97, 244/53, 244/57, 244/58, 246/27
• US Class Current: 361/719
• CPC Class Codes: G06F 1/183 Internal mounting support structures, e.g. for printed circuit boards, internal connecting means for buses G06F13/409
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink retention apparatus includes a base member and a heat sink mount including a pivotal base coupler and a board mounting member, whereby the heat sink mount is operable to mount to a board by engaging the pivotal base coupler with the base member and engaging the board mounting member with the board. A cable routing member and a connector storage member may be included on the heat sink mount for the routing of cables and the storing of connectors. A card retention device may be provided which is operable to couple to the heat sink mount and engage a card to retain the card on the board.

Claims

1. A heat sink retention apparatus comprising:

a base member; and

a heat sink mount including a pivotal base coupler and a board mounting member, whereby the heat sink mount is operable to mount to a board by engaging the pivotal base coupler with the base member and engaging the board mounting member with the board.

2. The apparatus of claim 1 wherein the heat sink mount comprises a cable routing member.

3. The apparatus of claim 1 wherein the heat sink mount comprises a connector storage member.

4. The apparatus of claim 1 wherein the heat sink mount comprises a card retention device coupling member.

5. The apparatus of claim 1 further comprising:

a card retention device which is operable to couple to the heat sink mount.

6. The apparatus of claim 1 further comprising:

a heat sink mounted in the heat sink mount.

7. The apparatus of claim 1 further comprising:

a board including a heat producing component mounted to the board, whereby the base member is mounted to the board and the heat sink mount is pivotally coupled to the base member with the board mount member engaging the board; and

a heat sink mounted in the heat sink mount and engaging the heat producing component.

8. The apparatus of claim 7 further comprising:

a card mounted to the board; and

a card retention device coupled to the heat sink mount and engaging the card to retain the card on the board.

9. A heat sink retention apparatus comprising:

a heat sink mount;

a cable routing member on the heat sink mount; and

a connector storage member on the heat sink mount.

10. The apparatus of claim 9 wherein the heat sink mount comprises a card retention device coupling member.

11. The apparatus of claim 9 further comprising:

a card retention device which is operable to couple to the heat sink mount.

12. The apparatus of claim 9 further comprising:

a heat sink mounted in the heat sink mount.

13. The apparatus of claim 9 further comprising:

a board including a heat producing component mounted to the board, whereby the heat sink mount is mounted to the board;

a heat sink mounted in the heat sink mount and engaging the heat producing component;

a cable routed in the cable routing member; and

a connector stored in the connector storage member.

14. The apparatus of claim 13 further comprising:

a card mounted to the board; and

a card retention device coupled to the heat sink mount and engaging the card to retain the card on the board.

15. A heat sink retention apparatus comprising:

a heat sink mount;

a card retention device which is operable to couple to the heat sink mount;

a board including a heat producing component mounted to the board, whereby the heat sink mount is mounted to the board;

a heat sink mounted in the heat sink mount and engaging the heat producing component; and

a card coupled to the board, whereby the card retention device is coupled to the heat sink mount and engages the card to retain the card on the board.

16. A heat sink retention apparatus comprising:

a heat sink mount; and

a card retention device which is operable to couple to the heat sink mount, wherein the heat sink mount comprises a cable routing member.

17. A heat sink retention apparatus comprising:

a heat sink mount; and

a card retention device which is operable to couple to the heat sink mount, wherein the heat sink mount comprises a connector storage member.

18. The apparatus of claim 17 wherein the heat sink mount comprises a card retention device coupling member.

19. The apparatus of claim 17 further comprising:

a heat sink mounted in the heat sink mount.

20. A method for heat sink and card retention comprising:

providing a board including a heat producing component mounted to the board;

providing a heat sink mount including a heat sink mounted in the heat sink mount;

mounting the heat sink mount to the board, whereby the mounting engages the heat sink with the heat producing component;

coupling a card to the board; and

coupling a card retention device to the heat sink mount, whereby the coupling a card retention device to the heat sink mount includes engaging the card with the card retention device and retaining the card on the board.

21. The method of claim 20 wherein the mounting the heat sink to the board comprises:

providing a base mounting member on the heat sink mount;

mounting a base member to the board;

pivotally coupling the heat sink mount to the base member; and

engaging the base mounting member with the board.

22. The method of claim 20 further comprising:

providing a cable routing member and a connector storage member on the heat sink mount;

routing a cable in the cable routing member; and

storing a connector in the connector storage member.

23. A heat sink and card retention apparatus comprising:

a base member;

a heat sink mount including a pivotal base coupler and a board mounting member, whereby the heat sink mount is operable to mount to a board by engaging the pivotal base coupler with the base member and engaging the board mounting member with the board;

a cable routing member on the heat sink mount;

a connector storage member on the heat sink mount; and

a card retention device which is operable to couple to the heat sink mount to retain a card on a board.