Method for programming a multilevel phase change memory device

• US 7,272,037 B2
• Filed: 10/29/2004
• Issued: 09/18/2007
• Est. Priority Date: 10/29/2004
• Status: Expired due to Fees

• Current Assignee: Macronix International Co., Ltd.
• Original Assignee: Macronix International Co., Ltd.
• Inventors: Chen, Yi Chou, Lee, Ming Hsiu
• Primary Examiner(s): AUDUONG, GENE NGHIA
• Application Number:
  US10/976,648
• Publication Number:
  US 20060091373A1
• Time in Patent Office: 1,054 Days
• Field of Search: 365/163, 365/100, 365/148, 365/113, 365/114, 365/185.03
• US Class Current: 365/163
• CPC Class Codes: G11C 11/5678 using amorphous/crystalline phase transition storage elements
• CPC Class Codes: G11C 13/0004 comprising amorphous/crystalline phase transition cells
• CPC Class Codes: G11C 13/0069 Writing or programming circuits or methods
• CPC Class Codes: G11C 2013/0092 Write characterized by the shape, e.g. form, length, amplitude of the write pulse

Abstract

A method of programming a phase change device includes selecting a desired threshold voltage (Vth) and applying a programming pulse to a phase change material in the phase change device. The applying of the programming pulse includes applying a quantity of energy to the phase change material to drive at least a portion of this material above a melting energy level. A portion of the energy applied to the phase change material is allowed to dissipate below the melting energy level. The shape of the energy dissipation from the phase change material is controlled until the energy applied to the phase change material is less than a quenched energy level, to cause the phase change device to have the desired Vth. A remaining portion of the energy applied to the phase change material is allowed to dissipate to an environmental level.

Claims

1. A method of programming a phase change device comprising:

selecting a desired threshold voltage (Vth); and

applying a programming pulse to a phase change material in the phase change device including;

applying a quantity of energy to the phase change material to drive at least a portion of the phase change material above a melting energy level, the quantity of energy being applied for a first time interval;

allowing a portion of the energy applied to the phase change material to dissipate below the melting energy level;

controlling a shape of an energy dissipation from the phase change material until the energy applied to the phase change material is less than a quenched energy level, wherein the shape of the energy dissipation is controlled to cause the phase change device to have the desired Vth; and

allowing a remaining portion of the energy applied to the phase change material to dissipate to an environmental level.

2. The method of claim 1, wherein the energy applied to the phase change material includes at least one of electrical current, heat, light, voltage.

3. The method of claim 1, wherein the desired Vth level corresponds to a desired data value.

4. The method of claim 1, wherein the desired Vth level is one of a plurality of desired Vth levels and each one of the plurality of desired Vth levels corresponds to one of a plurality of desired data values.

5. The method of claim 1, wherein the quantity of the energy applied to the phase change material is a function of an operating parameter.

6. The method of claim 5, wherein the operating parameter includes at least one of an operating temperature and an input voltage.

7. The method of claim 5, wherein the function of the operating parameter compensates for a variation in the operating parameter.

8. The method of claim 1, wherein the quantity of the energy applied to the phase change material is a function of a phase change manufacturing process variable.

9. The method of claim 8, wherein the phase change manufacturing process variable includes at least one of a group consisting of a phase change material type, a film thickness, and a phase change contact size.

10. The method of claim 8, wherein the function of the phase change manufacturing process variable compensates for a variation in the phase change manufacturing process variable.

11. The method of claim 1, wherein controlling the shape of the energy dissipation from the phase change material until the energy applied to the phase change material is less than the quenched energy level includes applying multiple energy sub-pulses.

12. The method of claim 11, wherein the sub-pulse has profile of at least one of a square, a triangle, one or more stairs, a trapezoid, a trapezium, a square with straight sloping pattern, a square with u-shaped tail pattern, a square with a reverse u-shaped tail pattern, or a combination thereof.

13. The method of claim 1, wherein the programming pulse has profile of at least one of a square, a triangle, one or more stairs, a trapezoid, a trapezium, a square with straight sloping pattern, a square with u-shaped tail pattern, a square with a reverse u-shaped tail pattern, or a combination thereof.

14. The device of claim 1, wherein the phase change material includes a chalcogenide material.

15. A method of programming a multi-state phase change device comprising:

selecting a desired threshold voltage (Vth), from a plurality of desired Vths, each one of the plurality of desired Vths corresponding to one of a plurality of data values; and

applying a programming pulse to a phase change material in the phase change device including;

applying a quantity of energy to the phase change material to drive at least a portion of the phase change material above a melting energy level, the quantity of energy being applied for a first time interval;

allowing a portion of the energy applied to the phase change material to dissipate below the melting energy level;

controlling a shape of an energy dissipation from the phase change material until the energy applied to the phase change material is less than a quenched energy level, wherein the shape of the energy dissipation is controlled to cause the phase change device to have the desired Vth; and

allowing a remaining portion of the energy applied to the phase change material to dissipate to an environmental level.

16. The method of claim 15, wherein the quantity of the energy applied to the phase change material is a function of an operating parameter.

17. The method of claim 15, wherein the quantity of the energy applied to the phase change material is a function of a phase change manufacturing process variable.

18. A method of programming a memory array comprising:

selecting a desired threshold voltage (Vth); and

applying a programming pulse to a phase change memory device in the memory array, wherein a steering element applies the programming pulse to the phase change memory device including;

applying a quantity of energy to the phase change device to drive at least a portion of a phase change material in the phase change device above a melting energy level, the quantity of energy being applied for a first time interval;

allowing a portion of the energy applied to the phase change material to dissipate below the melting energy level;

controlling a shape of an energy dissipation from the phase change material until the energy applied to the phase change material is less than a quenched energy level, wherein the shape of the energy dissipation is controlled to cause the phase change device to have the desired Vth; and

allowing a remaining portion of the energy applied to the phase change material to dissipate to an environmental level.

19. The method of claim 18, wherein the desired Vth level is one of a plurality of desired Vth levels and each one of the plurality of desired Vth levels corresponds to one of a plurality of desired data values.

20. The method of claim 18, wherein the quantity of the energy applied to the phase change material is a function of an operating parameter.

21. The method of claim 18, wherein the quantity of the energy applied to the phase change material is a function of a phase change manufacturing process variable.