Microelectromechanical (MEM) device including a spring release bridge and method of making the same
First Claim
1. A method for forming a microelectromechanical (MEM) device on a substrate including at least an active layer, and a sacrificial layer disposed at least partially therebetween, the method comprising the steps of:
- forming at least an anchor region and a suspension region in the active layer, the suspension region having formed therein at least a mass structure, a suspension spring, and a release bridge, the suspension spring coupled between the anchor region and the mass structure, the release bridge coupled to the suspension spring and to the mass structure; and
removing at least a portion of the sacrificial layer to thereby release the mass structure, the release bridge, and the suspension spring from the substrate,wherein the release bridge is sized such that the mass structure and the suspension spring are released substantially simultaneously during sacrificial layer removal.
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Accused Products
Abstract
A microelectromechanical (MEM) device includes a substrate, a suspension spring, a structure, and a release bridge. The suspension spring is coupled to, and suspended above, the substrate. The structure is coupled to the suspension spring and is resiliently suspended thereby above the substrate. The release bridge is coupled to the suspension spring. During sensor manufacture, the suspension spring and structure are suspended above the substrate by undergoing a release process. The release bridge is sized such that, during the release process, the structure and the suspension spring are released substantially simultaneously.
32 Citations
32 Claims
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1. A method for forming a microelectromechanical (MEM) device on a substrate including at least an active layer, and a sacrificial layer disposed at least partially therebetween, the method comprising the steps of:
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forming at least an anchor region and a suspension region in the active layer, the suspension region having formed therein at least a mass structure, a suspension spring, and a release bridge, the suspension spring coupled between the anchor region and the mass structure, the release bridge coupled to the suspension spring and to the mass structure; and removing at least a portion of the sacrificial layer to thereby release the mass structure, the release bridge, and the suspension spring from the substrate, wherein the release bridge is sized such that the mass structure and the suspension spring are released substantially simultaneously during sacrificial layer removal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for forming an inertial sensor on a substrate, comprising the steps of:
- forming a sacrificial layer on a surface of the substrate;
forming an active layer over at least a portion of the sacrificial layer; forming at least an anchor region and a suspension region in the active layer, the suspension region having formed therein at least a mass structure, a suspension spring, and a release bridge, the suspension spring coupled between the anchor region and the mass structure, and the release bridge coupled to the suspension spring and to the mass structure; and removing at least a portion of the sacrificial layer to thereby release the mass structure, the release bridge, and the suspension spring from the substrate, wherein the release bridge is sized such that the mass structure and the suspension spring are released substantially simultaneously during sacrificial layer removal. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
- forming a sacrificial layer on a surface of the substrate;
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29. A method for forming a microelectromechanical (MEM) device on a substrate including at least an active layer, and a sacrificial layer disposed at least partially therebetween, the method comprising the steps of:
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forming at least an anchor region and a suspension region in the active layer, the suspension region having formed therein at least a structure, a suspension spring, and a release bridge, the suspension spring coupled between the anchor region and the structure, the release bridge coupled to the suspension spring; removing at least a portion of the sacrificial layer to thereby release the structure, the release bridge, and the suspension spring from the substrate; forming a plurality of etch openings in the active layer; exposing the sacrificial layer to a first etchant via the etch openings, whereby at least a portion of the sacrificial layer is removed; depositing a backfill material in at least selected ones of the etch openings; exposing at least the deposited backfill material to a first etchant to thereby remove at least a substantial portion of the backfill material; and exposing the sacrificial layer to a second etchant, whereby at least a portion of the sacrificial layer is removed to thereby release the structure, the release bridge, and the suspension spring, wherein the backfill material comprises phosphosilicate glass, and wherein the release bridge is sized such that the structure and the suspension spring are released substantially simultaneously during sacrificial layer removal. - View Dependent Claims (30, 31, 32)
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Specification