Method of producing a micro-electromechanical element
First Claim
1. A method of producing a micro-electromechanical element comprising the following steps:
- a) structuring a first intermediate layer, which is applied to a first main surface of a first semiconductor wafer, so as to produce a recess;
b) connecting the first semiconductor wafer via the first-intermediate layer to a second semiconductor wafer in such a way that a hermetically sealed cavity is defined by the recess;
c) thinning one of the wafers from a surface facing away from said first intermediate layer so as to produce a diaphragm-like structure on top of the cavity;
d) producing electronic components in said thinned semiconductor wafer;
wherein in step a) the intermediate layer is structured in such a way that, when the two wafers have been connected, at least two hermetically sealed cavities are defined, which are interconnected by a channel, a respective diaphragm-like structure being arranged on top of each of said cavities after step c),and wherein the method additionally comprises the step e) of opening a defined opening through the diaphragm-like structure on top of one of the cavities.
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Abstract
In a method of producing a micro-electromechanical element a first intermediate layer, which is applied to a first main surface of a first semiconductor wafer, is structured in a first step so as to produce a recess. The first semiconductor wafer is connected via the first intermediate layer to a second semiconductor wafer in such a way that a hermetically sealed cavity is defined by the recess. When one of the wafers has been thinned from a surface facing away from said first intermediate layer so as to produce a diaphragm-like structure on top of the cavity, electronic components are produced in said thinned semiconductor wafer making use of standard semiconductor processes. At least one further intermediate layer between the two semiconductor wafers is provided, which, prior to the connection of the two semiconductor wafers, is structured in such a way that the structure formed in said at least one further intermediate layer and the recess in said first intermediate layer define the cavity. Finally at least one defined opening is produced so as to provide access to the hermetically sealed cavity.
33 Citations
10 Claims
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1. A method of producing a micro-electromechanical element comprising the following steps:
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a) structuring a first intermediate layer, which is applied to a first main surface of a first semiconductor wafer, so as to produce a recess; b) connecting the first semiconductor wafer via the first-intermediate layer to a second semiconductor wafer in such a way that a hermetically sealed cavity is defined by the recess; c) thinning one of the wafers from a surface facing away from said first intermediate layer so as to produce a diaphragm-like structure on top of the cavity; d) producing electronic components in said thinned semiconductor wafer; wherein in step a) the intermediate layer is structured in such a way that, when the two wafers have been connected, at least two hermetically sealed cavities are defined, which are interconnected by a channel, a respective diaphragm-like structure being arranged on top of each of said cavities after step c), and wherein the method additionally comprises the step e) of opening a defined opening through the diaphragm-like structure on top of one of the cavities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification