Semiconductor device having box-shaped cylindrical storage nodes and fabrication method thereof
First Claim
1. A method of fabricating a semiconductor device, comprising:
- forming an interlayer insulating layer on a semiconductor substrate;
forming buried contact plugs penetrating the interlayer insulating layer;
sequentially forming a molding layer and a photoresist layer on the semiconductor substrate having the buried contact plugs formed thereon;
exposing the photoresist layer using a first phase shift mask having line-and-space type patterns, to form first exposure regions;
exposing the photoresist layer having the first exposure regions, using a second phase shift mask having line-and-space type patterns, to form second exposure regions intersecting the first exposure regions;
developing the photoresist layer having the first and the second exposure regions, to form a photoresist pattern having rectangular-shaped openings, the rectangular-shaped openings being formed at cross points of the first and the second exposure regions;
using the photoresist pattern in a process of etching the molding layer to form storage node holes exposing the buried contact plugs; and
forming storage nodes inside the storage node holes.
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Accused Products
Abstract
A method of forming box-shaped cylindrical storage nodes includes forming an interlayer insulating layer on a semiconductor substrate. Buried contact plugs are formed to penetrate the interlayer insulating layer. A molding layer and a photoresist layer are then sequentially formed on the substrate. Using a first phase shift mask having line-and-space patterns, the photoresist layer is exposed, forming first exposure regions. Using a second phase shift mask having line-and-space patterns, the photoresist layer is exposed again, forming second exposure regions intersecting the first exposure regions. The photoresist layer is then developed, forming a photoresist pattern having rectangular-shaped openings formed at intersections of the first and the second exposure regions. The molding layer is etched using the photoresist pattern as an etch mask, forming storage node holes exposing the buried contact plugs. Storage nodes are formed inside the storage node holes.
42 Citations
22 Claims
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1. A method of fabricating a semiconductor device, comprising:
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forming an interlayer insulating layer on a semiconductor substrate; forming buried contact plugs penetrating the interlayer insulating layer; sequentially forming a molding layer and a photoresist layer on the semiconductor substrate having the buried contact plugs formed thereon; exposing the photoresist layer using a first phase shift mask having line-and-space type patterns, to form first exposure regions; exposing the photoresist layer having the first exposure regions, using a second phase shift mask having line-and-space type patterns, to form second exposure regions intersecting the first exposure regions; developing the photoresist layer having the first and the second exposure regions, to form a photoresist pattern having rectangular-shaped openings, the rectangular-shaped openings being formed at cross points of the first and the second exposure regions; using the photoresist pattern in a process of etching the molding layer to form storage node holes exposing the buried contact plugs; and forming storage nodes inside the storage node holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of fabricating a semiconductor device, comprising:
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forming an interlayer insulating layer on a semiconductor substrate; forming buried contact plugs penetrating the interlayer insulating layer; sequentially forming a molding layer, a first hard mask layer, and a second hard mask layer on the semiconductor substrate having the buried contact plugs formed thereon; patterning the second hard mask layer, to form line-and-space type upper hard mask patterns; patterning the first hard mask layer to form line-and-space type lower hard mask patterns, wherein the lines of the lower hard mask patterns are arranged at an angle with respect to the lines of the upper hard mask pattern when viewed from a plan view, above; etching the molding layer using the upper and the lower hard mask patterns as etch masks to form storage node holes exposing the buried contact plugs; and forming storage nodes inside the storage node holes. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of fabricating a semiconductor device, comprising:
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forming an interlayer insulating layer on a semiconductor substrate; forming buried contact plugs penetrating the interlayer insulating layer; sequentially forming a molding layer and a hard mask layer on the semiconductor substrate having the buried contact plugs formed thereon; patterning the hard mask layer to form line-and-space type hard mask patterns; forming a photoresist layer on the semiconductor substrate having the hard mask patterns; patterning the photoresist layer to form line-and-space type photoresist patterns, wherein the lines of the photoresist patterns are arranged at an angle with respect to the lines of the hard mask pattern when viewed from a plan view, above; etching the molding layer using the photoresist patterns and the hard mask patterns as etch masks to form storage node holes exposing the buried contact plugs; and forming storage nodes inside the storage node holes. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification