Method of forming thin film patterning substrate including formation of banks

• US 7,273,801 B2
• Filed: 03/31/2005
• Issued: 09/25/2007
• Est. Priority Date: 03/17/1998
• Status: Expired due to Term

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kiguchi, Hiroshi, Seki, Shunichi, Miyajima, Hiroo, Yudasaka, Ichio
• Primary Examiner(s): Geyer; Scott B.
• Assistant Examiner(s): Ullah; Elias
• Application Number:
  US11/094,692
• Publication Number:
  US 20050170550A1
• Time in Patent Office: 908 Days
• Field of Search: 438/29, 438/30, 438/70, 438/584, 257/E21.001
• US Class Current: 438/584
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 33/22 characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/865 comprising light absorbing layers, e.g. light-blocking layers
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 59/8792 comprising light absorbing layers, e.g. black layers
• CPC Class Codes: H10K 71/135 using ink-jet printing
• CPC Class Codes: H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

Display devices such as EL elements or LED elements, are formed from thin film elements having banks of prescribed height and a thin film layer formed by an ink jet method in areas to be coated that are partitioned by those banks. The banks may be formed of an organic material on a bank formation surface configured of an inorganic material, plasma treatment is performed under conditions that the induction gas is fluorine-based and that fluorine is present excessively, and the areas enclosed by the banks subjected to surface treatment are filled with the liquid thin film material to form the thin film layer or layers.

Claims

1. A method for manufacturing a thin film patterning substrate, comprising:

providing a substrate;

forming banks on a surface of said substrate so as to form a plurality of areas partitioned by said banks, each of the banks having a width of a (μ

m) and a height of c (μ

m), and each one of the plurality of areas having a width of b (μ

m);

providing ink-jet droplets of a liquid material in said areas to form a thin film layer, said ink-jet droplets having a diameter of d (μ

m),

wherein said banks and said ink-jet droplets satisfy a relationship d/2<

b<

5d.

2. The method for manufacturing a thin film patterning substrate according to claim 1, said banks being formed so as to satisfy relationship a>

d/4.

3. The method for manufacturing a thin film patterning substrate according to claim 1, said banks being formed to satisfy a relationship c>

t₀ (where t₀ (μ

m) is film thickness of the thin film layer).

4. The method for manufacturing a thin film patterning substrate according to claim 1, said banks being formed so as to satisfy relationship c>

d/2b.

5. The method for manufacturing a thin film patterning substrate according to claim 1, further comprising:

forming at least upper surfaces of said banks of an organic substance.

6. The method for manufacturing a thin film patterning substrate according to claim 5, further comprising:

performing a surface treatment so that an angle of contact of the organic substance surface forming said banks is 50°

or greater, an angle of contact with the inorganic substance forming said banks is 20°

to 50°

, and an angle of contact of surfaces of said areas provided with said thin film liquid material is 30°

or greater.

7. The method for manufacturing a thin film patterning substrate according to claim 6, further comprising:

effecting said surface treatment by plasma treatment.

8. The method for manufacturing a thin film patterning substrate according to claim 1, further comprising:

forming at least upper surfaces and side surfaces of said banks of an organic substance.

9. The method for manufacturing a thin film patterning substrate according to claim 1, further comprising:

forming said banks in two layers including a lower-layer inorganic substance and an upper-layer organic substance.

10. The method for manufacturing a thin film patterning substrate according to claim 9, further comprising:

forming said banks in two layers including a lower-layer inorganic substance and an upper-layer organic substance, with at least side surfaces of said lower-layer inorganic substance not being covered by said upper-layer organic substance.

11. The method for manufacturing a thin film patterning substrate according to claim 1, wherein said areas comprise an inorganic substance.

12. The method for manufacturing a thin film patterning substrate according to claim 1, further comprising:

forming upper surfaces of upper portions of said banks to include liquid droplet reservoir structures.

13. A thin film element formed by the method of manufacturing a thin film patterning substrate recited in claim 1.

14. The method for manufacturing a thin film patterning substrate according to claim 1, said thin film layer comprising organic EL elements.

15. The method for manufacturing a thin film patterning substrate according to claim 1, said thin film layer comprising color filters.

16. A method for manufacturing a display device, the display device including a thin film patterning substrate, the method comprising:

providing a substrate;

forming banks on a surface of said substrate so as to form a plurality of areas partitioned by said banks, each of the banks having a width of a (μ

m) and a height of c (μ

m), and each one of the plurality of areas having a width of b (μ

m);

providing ink-jet droplets of a liquid material in said areas to form a thin film layer, said ink-jet droplets having a diameter of d (μ

m),

wherein said banks and said ink-jet droplets satisfy a relationship d/2<

b<

5d.

17. A method for manufacturing an electronic display circuit, including a circuit unit, and a display device, the display device including a thin film patterning substrate, the method comprising:

providing a substrate;

forming banks on a surface of said substrate so as to form a plurality of areas partitioned by said banks, each of the banks having a width of a (μ

m) and a height of c (μ

m), and each one of the plurality of areas having a width of b (μ

m);

providing ink-jet droplets of a liquid material in said areas to form a thin film layer, said ink-jet droplets having a diameter of d (μ

m),

wherein said banks and said ink-jet droplets satisfy a relationship d/2<

b<

5d.