Method for forming a ruthenium metal layer on a patterned substrate

• US 7,273,814 B2
• Filed: 03/16/2005
• Issued: 09/25/2007
• Est. Priority Date: 03/16/2005
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Matsuda, Tsukasa
• Primary Examiner(s): Lebentritt; Michael
• Assistant Examiner(s): Lee; Kyoung
• Application Number:
  US10/907,022
• Publication Number:
  US 20060211228A1
• Time in Patent Office: 923 Days
• Field of Search: None
• US Class Current: 438/680
• CPC Class Codes: C23C 16/18 from metallo-organic compounds
• CPC Class Codes: C23C 16/4481 by evaporation using carrier gas in contact with the source material C23C16/4486 takes precedence
• CPC Class Codes: C23C 16/45542 Plasma being used non-continuously during the ALD reactions
• CPC Class Codes: C23C 16/52 Controlling or regulating the coating process C23C16/45557, C23C16/279 take precedence
• CPC Class Codes: H01L 21/28556 by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76846 Layer combinations
• CPC Class Codes: H01L 21/76873 for electroplating
• CPC Class Codes: H01L 23/53238 Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A method for forming a ruthenium metal layer includes providing a patterned substrate in a process chamber of a deposition system, where the patterned substrate contains one or more vias or trenches, or combinations thereof, depositing a first ruthenium metal layer on the substrate in an atomic layer deposition process, and depositing a second ruthenium metal layer on the first ruthenium metal layer in a thermal chemical vapor deposition process. The deposited ruthenium metal layer can be used as a diffusion barrier layer, a seed layer for electroplating, or both.

Claims

1. A method for forming a ruthenium metal layer, comprising:

providing a patterned substrate in a process chamber of a deposition system, wherein the patterned substrate comprises one or more vias or trenches, or combinations thereof;

heating the patterned substrate to a first temperature and establishing a first pressure within the process chamber;

depositing a first ruthenium metal layer on the patterned substrate while maintaining the first temperature and the first pressure in an atomic layer deposition process comprising the alternating steps of first, exposing the substrate to a ruthenium organometallic precursor, and second, exposing the substrate to H₂ and/or NH₃ gas;

increasing the temperature of the patterned substrate from the first temperature to a higher second temperature and increasing the pressure in the process chamber from the first pressure to a higher second pressure; and

depositing a second ruthenium metal layer on the first ruthenium metal layer while maintaining the second temperature and the second pressure in a thermal chemical vapor deposition process comprising concurrently exposing the patterned substrate to a ruthenium organometallic precursor and H₂ and/or NH₃ gas.

2. The method according to claim 1, wherein the depositing a first ruthenium metal layer comprises a plasma-enhanced atomic layer deposition process wherein the second alternating exposure step comprises exposing the substrate to a plasma of the H₂ and/or NH₃ gas.

3. The method according to claim 1, further comprising:

purging the process chamber with an inert gas between the alternating exposure steps.

4. The method according to claim 1, wherein the first and second alternating exposure steps are performed a desired number of times to deposit the first ruthenium metal layer to a thickness of about 1-10 nm.

5. The method according to claim 1, wherein the depositing a first ruthenium metal layer comprises a thermal atomic layer deposition process.

6. The method according to claim 1, wherein the thickness of the second ruthenium metal layer is greater than the thickness of the first ruthenium metal layer.

7. The method according to claim 1, wherein the first and second ruthenium metal layers are deposited from a ruthenium organometallic precursor comprising at least one of (2,4-dimethylpentadienyl)(ethylcyclopentadienyl) ruthenium, bis(2,4-dimethylpentadienyl) ruthenium, 2,4-dimethylpentadienyl) (methylcyclopentadienyl) ruthenium, or bis (ethylcyclopentadienyl) ruthenium, or a combination thereof.

8. The method according to claim 1, wherein the first pressure is between about 5 mTorr and about 500 mTorr and the second pressure is between about 500 mTorr and about 30 Torr.

9. The method according to claim 1, wherein the patterned substrate further comprises a barrier layer formed thereon onto which the first ruthenium metal layer is deposited, wherein the barrier layer is Ta, TaN, TaCN, W or WN, or a combination thereof.