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Wafer level capped sensor

  • US 7,275,424 B2
  • Filed: 03/23/2005
  • Issued: 10/02/2007
  • Est. Priority Date: 09/08/2003
  • Status: Active Grant
First Claim
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1. A sensor comprising:

  • a die having a working portion;

    a cap coupled with the die to at least partially cover the working portion;

    a sensing component within the working portion;

    amplification circuitry operatively coupled with the sensing component; and

    a conductive pathway extending through the cap to the working portion, the pathway providing an electrical interface to the working portion,the amplification circuitry being electrically positioned between the sensing component and the conductive pathway.

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