Wafer level capped sensor
First Claim
Patent Images
1. A sensor comprising:
- a die having a working portion;
a cap coupled with the die to at least partially cover the working portion;
a sensing component within the working portion;
amplification circuitry operatively coupled with the sensing component; and
a conductive pathway extending through the cap to the working portion, the pathway providing an electrical interface to the working portion,the amplification circuitry being electrically positioned between the sensing component and the conductive pathway.
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Accused Products
Abstract
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
72 Citations
13 Claims
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1. A sensor comprising:
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a die having a working portion; a cap coupled with the die to at least partially cover the working portion; a sensing component within the working portion; amplification circuitry operatively coupled with the sensing component; and a conductive pathway extending through the cap to the working portion, the pathway providing an electrical interface to the working portion, the amplification circuitry being electrically positioned between the sensing component and the conductive pathway. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A sensor comprising:
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a die having a working portion with movable structure and circuitry for detecting movement of the movable structure, the working portion also having amplification circuitry; and a cap having a conductive pathway therethrough, the amplification circuitry being electrically positioned between the conductive pathway and the movable structure. - View Dependent Claims (12, 13)
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Specification