Memory cell and method for forming the same
First Claim
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1. A method for forming a plurality of memory cell structures on a surface of a substrate, comprising:
- forming an active region in the substrate;
forming a plurality of posts on the surface of the substrate over the active region, the plurality of posts formed from a semiconductor material and spaced apart from one another by respective regions;
forming a plurality of contacts over and electrically coupled to the active region, each contact having at least a portion formed adjacent a respective one of the regions for a pair of posts;
forming a plurality of memory cell capacitors on a respective one of the plurality of posts; and
forming a plurality of gate structures adjacent a respective one of the plurality of posts to form a respective vertical transistor to electrically couple the respective memory cell capacitor to the active region.
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Abstract
A semiconductor memory cell structure having 4F2 dimensions and method for forming the same. The memory cell is formed on a surface of a substrate and includes an active region formed in the substrate, a semiconductor post formed on the surface of the substrate over the active region and a capacitor is formed on the semiconductor post. A vertical access transistor having a gate structure formed on the semiconductor post is configured to electrically couple the respective memory cell capacitor to the active region when accessed.
31 Citations
25 Claims
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1. A method for forming a plurality of memory cell structures on a surface of a substrate, comprising:
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forming an active region in the substrate; forming a plurality of posts on the surface of the substrate over the active region, the plurality of posts formed from a semiconductor material and spaced apart from one another by respective regions; forming a plurality of contacts over and electrically coupled to the active region, each contact having at least a portion formed adjacent a respective one of the regions for a pair of posts; forming a plurality of memory cell capacitors on a respective one of the plurality of posts; and forming a plurality of gate structures adjacent a respective one of the plurality of posts to form a respective vertical transistor to electrically couple the respective memory cell capacitor to the active region. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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2. The method of 1 wherein forming the plurality of contacts comprises forming each contact of the plurality of contacts over a respective portion of the active region that extends laterally on the surface of the substrate from a respective region between a pair of posts.
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10. A method for forming a plurality of memory cell structures on a surface of a substrate, comprising:
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forming an active region in the substrate; forming a semiconductor post on the active region; forming first and second contacts on the active region and laterally disposed on opposite sides of the semiconductor post along the surface of the substrate; forming a memory cell capacitor on the semiconductor post; and forming a vertical access transistor having a gate adjacent the semiconductor post and to electrically couple the capacitor to the first and second contacts in response to being activated. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification