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Inspection system, inspection method, and method for manufacturing semiconductor device

  • US 7,276,929 B2
  • Filed: 09/22/2006
  • Issued: 10/02/2007
  • Est. Priority Date: 01/30/2004
  • Status: Expired due to Fees
First Claim
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1. An inspection apparatus comprising:

  • a plurality of inspection electrodes;

    a plurality of inspection antennas;

    means for controlling a position;

    means for applying a voltage to each of the plurality of inspection antennas; and

    means for measuring potentials of the plurality of inspection electrodes;

    wherein a plurality of chips and the plurality of inspection electrodes are overlapped with a certain space therebetween;

    the plurality of chips and the plurality of inspection antennas are overlapped with a certain space therebetween; and

    the plurality of chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the means for controlling a position.

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