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Multi-substrate microstrip to waveguide transition

  • US 7,276,988 B2
  • Filed: 06/30/2004
  • Issued: 10/02/2007
  • Est. Priority Date: 06/30/2004
  • Status: Active Grant
First Claim
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1. A transition for interfacing a microwave waveguide with an external circuit, the waveguide having a substantially hollow interior with an opening including a lip having an inner edge and an outer edge, the waveguide further defining a direction of electric field propagation parallel to a first direction, the transition comprising:

  • a first substrate extending in a plane substantially transverse to the first direction;

    a conducting ground plane attached to the first substrate;

    a microstrip signal conductor attached to the first substrate and separated from the ground plane by the first substrate;

    a second substrate disposed substantially parallel to the first substrate, the second substrate extending at least partially into the interior of the waveguide; and

    a conducting probe attached to the second substrate and mounted directly onto the signal conductor, the probe extending at least partially into the interior of the waveguide in a plane substantially transverse to the first direction.

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