Refrigeration system including thermoelectric module
First Claim
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1. A method of conditioning a space with a refrigeration system, the method comprising:
- operating a vapor compression cycle as first heat sink for a first side of a thermoelectric device;
circulating a heat-transfer fluid flowing through a heat-transfer circuit in heat-transfer relation with a second side of a thermoelectric device;
transferring heat from an air flow in the space to said heat-transfer fluid;
transferring heat between said first heat sink and said second heat sink to condition the space,wherein said transferring heat between said first and second heat sinks includes transferring heat from said heat-transfer fluid through said thermoelectric device to a compressible fluid flowing through said vapor compression cycle.
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Abstract
A method of conditioning a space with a refrigeration system includes circulating a first heat sink for a first side of a thermoelectric device and circulating a second heat sink for a second side of the thermoelectric device. The method also includes transferring heat between the first heat sink and the second heat sink to condition the space.
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Citations
11 Claims
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1. A method of conditioning a space with a refrigeration system, the method comprising:
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operating a vapor compression cycle as first heat sink for a first side of a thermoelectric device; circulating a heat-transfer fluid flowing through a heat-transfer circuit in heat-transfer relation with a second side of a thermoelectric device; transferring heat from an air flow in the space to said heat-transfer fluid; transferring heat between said first heat sink and said second heat sink to condition the space, wherein said transferring heat between said first and second heat sinks includes transferring heat from said heat-transfer fluid through said thermoelectric device to a compressible fluid flowing through said vapor compression cycle. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A refrigeration system comprising:
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a thermoelectric device that forms a temperature gradient between first and second sides; a vapor compression circuit forming a first heat sink in heat-transferring relation with said first side of said thermoelectric device; a second heat sink in heat-transferring relation with said second side of said thermoelectric device, said second heat sink including a heat-transfer fluid flowing through a heat-transfer circuit in heat-transfer relation with said second side of said thermoelectric device, wherein heat is transferred between said first heat sink and said second heat sink through said thermoelectric device to condition a space, said heat-transfer circuit includes a heat exchanger through which said heat-transfer fluid flows and over which an air flow flowing through said space flows and heat is transferred from said air flow to said heat-transfer fluid through said thermoelectric device and to said second heat sink to condition said space. - View Dependent Claims (9, 10, 11)
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Specification