Method for manufacturing a light-emitting structure of a light-emitting device (LED)
First Claim
1. A method for manufacturing a light emitting device of a light-emitting device (LED), comprising:
- (a) forming a buffer layer over an upper side of a substrate, wherein said substrate comprises sapphire, silicon carbide (SiC) and gallium nitride (GaN);
(b) forming an n-GaN based epitaxial layer over said buffer layer;
(c) forming an MQW layer over said n-GaN based epitaxial layer, wherein said MQW active layer comprises a material so that said MQW active layer emits a light with a wavelength comprising 380 nm to 600 nm in response to an applied electric power on said light-emitting structure;
(d) forming a p-type distributed Brag reflector (DBR) over said MQW active layer;
(e) forming a p-GaN based layer over said p-type DBR, etching away a portion of said n-GaN based layer, said MQW active layer, said p-type DBR and said p-GaN based layer whereby said n-GaN based layer has an exposing region and disposing an n-type electrode over said exposing region and a p-type electrode over said remaining p-GaN based layer after said etching; and
(f) coating a metal reflector over a bottom side of said substrate.
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Accused Products
Abstract
A method for manufacturing a light-emitting structure of a light-emitting device (LED) is disclosed. The white colored LED includes a resonant cavity structure, producing and mixing lights which may mix into a white colored light in the resonant cavity structure, so that the white colored LED may be more accurately controlled in its generated white colored light, which efficiently reduces deficiency, generates natural white colored light and aids in luminous efficiency promotion. In addition to the resonant cavity structure, the light-emitting structure also includes a contact layer, an n-type metal electrode, and a p-type metal electrode.
43 Citations
6 Claims
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1. A method for manufacturing a light emitting device of a light-emitting device (LED), comprising:
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(a) forming a buffer layer over an upper side of a substrate, wherein said substrate comprises sapphire, silicon carbide (SiC) and gallium nitride (GaN); (b) forming an n-GaN based epitaxial layer over said buffer layer; (c) forming an MQW layer over said n-GaN based epitaxial layer, wherein said MQW active layer comprises a material so that said MQW active layer emits a light with a wavelength comprising 380 nm to 600 nm in response to an applied electric power on said light-emitting structure; (d) forming a p-type distributed Brag reflector (DBR) over said MQW active layer; (e) forming a p-GaN based layer over said p-type DBR, etching away a portion of said n-GaN based layer, said MQW active layer, said p-type DBR and said p-GaN based layer whereby said n-GaN based layer has an exposing region and disposing an n-type electrode over said exposing region and a p-type electrode over said remaining p-GaN based layer after said etching; and (f) coating a metal reflector over a bottom side of said substrate. - View Dependent Claims (2, 3)
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4. A method for manufacturing a light-emitting structure of a light-emitting device (LED), which comprises the steps of:
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(a) forming a buffer layer over an upper side of a substrate wherein said substrate comprises sapphire, silicon carbide (SiC), silicon (Si) and gallium nitride (GaN); (b) forming an n-type DBR on said buffer layer; (c) forming an n-GaN based layer over said n-type DBR; (d) forming an MQW active layer over said n-GaN based layer, wherein said MQW active layer comprises a material so that said MQW active layer emits a light with a wavelength of 380–
600 nm upon an applied electric power;(e) forming a p-type distributed Brag reflector (DBR) over said MQW active layer; and (f) forming a p-GaN based layer over said p-type DBR and etching away a portion of said p-GaN based layer, said p-type DBR, said MQW active layer and said n-GaN based layer whereby said n-GaN based layer has an exposing region and disposing an-type electrode over said exposing region of said n-GaN based layer and disposing a p-type electrode over said p-GaN based layer, wherein the light-emitting structure between the n-type DBR and the p-type DBR includes the n-GaN based layer formed directly on the n-type DBR, the MQW active layer formed directly on the n-GaN based layer, and the D-type DBR forming the formed directly on the MQW active layer. - View Dependent Claims (5, 6)
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Specification