Wiring board mounting a capacitor

• US 7,279,771 B2
• Filed: 03/28/2005
• Issued: 10/09/2007
• Est. Priority Date: 03/31/2004
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Sunohara, Masahiro, Murayama, Kei, Higashi, Mitsutoshi, Gomyo, Toshio, Takeuchi, Yukiharu
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US11/090,029
• Publication Number:
  US 20050218502A1
• Time in Patent Office: 925 Days
• Field of Search: None
• US Class Current: 257/516
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/0792 Means against parasitic impedance; Means against eddy currents
• CPC Class Codes: H05K 2201/09772 Conductors directly under a component but not electrically connected to the component
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

In a capacitor-mounted wiring board, a plurality of wiring layers each patterned in a required shape are stacked with insulating layers interposed therebetween and are connected to each other via conductors formed to pierce the insulating layers in the direction of thickness. A decoupling capacitor is electrically connected to a wiring layer used as a power supply line or a ground line in the vicinity of the wiring layer, and mounted such that, when a current is passed through the capacitor, the direction of the current is reversed to that of the current flowing through the relevant wiring layer.

Claims

1. A capacitor-mounted wiring board comprising:

a plurality of wiring layers each patterned in a required shape;

the plurality of wiring layers being stacked with insulating layers interposed therebetween and connected to each other via conductors formed to pierce the insulating layers in a direction of thickness; and

a capacitor surface-mounted on at least one of the same surface on which a semiconductor element, an electronic component, or the like, is to be mounted;

the capacitor being mounted such that the capacitor is electrically connected to a wiring layer used as any one of a power supply line and a ground line, and in a vicinity of the wiring layer among the plurality of wiring layers, and such that, when a current is passed through the capacitor, a direction of the current and a direction of a current flowing through the wiring layer are reversed.

2. The capacitor-mounted wiring board according to claim 1, wherein the capacitor is mounted such that a path of the current flowing through the capacitor becomes approximately parallel to a path of the current flowing through the wiring layer.

3. A capacitor-mounted wiring board comprising:

a plurality of wiring layers each patterned in a required shape;

the plurality of wiring layers being stacked with insulating layers interposed therebetween and connected to each other via conductors formed to pierce the insulating layers in a direction of thickness; and

a capacitor is mounted in a buried manner in one of the insulating layers;

the capacitor being mounted such that the capacitor is electrically connected to a first wiring layer used as a power supply line and a second wiring layer used as a ground line, and among the plurality of wiring layers to be sandwiched between the first and second wiring layers;

wherein, when a current is passed through the capacitor, a direction of the current is reversed to a direction of a current flowing through the first and second wiring layers; and

, a path of the current flowing through the capacitor becomes approximately parallel to a path of the current flowing through the wiring layer.

4. The capacitor-mounted wiring board according to claim 3, wherein one electrode of the capacitor is engaged with a third wiring layer to be electrically connected to the third wiring layer, the third wiring layer being formed in an approximately L shape when viewed in a cross section and being electrically connected to the second wiring layer;

and another electrode of the capacitor is electrically connected to the first wiring layer via the conductor formed to pierce the insulating layer in the direction of thickness.

5. The capacitor-mounted wiring board according to claim 3, wherein one electrode of the capacitor is engaged with a third wiring layer to be electrically connected to the third wiring layer, the third wiring layer being formed in an L shape when viewed in a cross section and being electrically connected to the second wiring layer via the conductor formed to pierce the insulating layer in the direction of thickness;

and another electrode of the capacitor is electrically connected to the first wiring layer via the conductor formed to pierce the insulating layer in the direction of thickness.