Low inductance semiconductor device having half-bridge configuration
First Claim
1. A semiconductor device comprising a first element and a second element of a half-bridge, having first, second, and third connecting leads, whereinthe first element of the half-bridge comprises at least a first semiconductor element and a first freewheeling component,the second element of the half-bridge comprises at least a second semiconductor element and a second freewheeling component,the first connecting lead is connected by an electrically conducting connection to the first semiconductor element, and the second connecting lead is connected to the second semiconductor element,the first connecting lead and the second connecting lead are used for DC supply and are arranged parallel to each other, at least in parts,the third connecting lead constitutes a load terminal of the half-bridge,the first, second and third connecting leads each have a base point facing a substrate, and whereinconnecting a first hypothetical line between centroids of the base points of the first and third connecting leads, and a second hypothetical line between the centroids of the base points of the second and third connecting leads enclose an angle greater than 0°
- and less than or equal to 20°
.
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Accused Products
Abstract
A semiconductor device has first, second, and third connecting leads (1, 2, 3), whose respective base points (1f, 2f, 3f) have centroids (1m, 2m, 3m). The connecting leads are arranged wherein an angle (α) between a first line drawn between the centroids (1m, 3m) of the base points (1f, 3f) of first lead (1) and third lead (3) and a second line drawn between the centroids (2m, 3m) of the base points (2f, 3f) of second lead (2) and third lead (3) is 20° maximum. In addition, a semiconductor module may incorporate two or more semiconductor devices which are connected electrically in parallel.
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Citations
20 Claims
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1. A semiconductor device comprising a first element and a second element of a half-bridge, having first, second, and third connecting leads, wherein
the first element of the half-bridge comprises at least a first semiconductor element and a first freewheeling component, the second element of the half-bridge comprises at least a second semiconductor element and a second freewheeling component, the first connecting lead is connected by an electrically conducting connection to the first semiconductor element, and the second connecting lead is connected to the second semiconductor element, the first connecting lead and the second connecting lead are used for DC supply and are arranged parallel to each other, at least in parts, the third connecting lead constitutes a load terminal of the half-bridge, the first, second and third connecting leads each have a base point facing a substrate, and wherein connecting a first hypothetical line between centroids of the base points of the first and third connecting leads, and a second hypothetical line between the centroids of the base points of the second and third connecting leads enclose an angle greater than 0° - and less than or equal to 20°
. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- and less than or equal to 20°
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11. A semiconductor module having a first semiconductor device and a second semiconductor device which are arranged on a common substrate and connected electrically in parallel, wherein the common substrate comprises for each semiconductor device:
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a first element arranged on the common substrate comprising at least a first semiconductor element and a first freewheeling component, a second element arranged on the common substrate comprising at least a second semiconductor element and a second freewheeling component, a first connecting lead coupled by an electrically conducting connection with the first semiconductor element, and a second connecting lead coupled with the second semiconductor element, wherein the first and second connecting leads are at least partly arranged in parallel to each other, and a third connecting lead, wherein the first, second and third connecting leads each have a base point facing the common substrate, and wherein a first hypothetical connecting line between centroids of the base points of the first and third connecting leads, and a second hypothetical connecting line between the centroids of the base points of the second and third connecting leads enclose an angle of greater than 0° and
less than or equal to 20°
. - View Dependent Claims (12, 13, 14, 15)
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16. A semiconductor device having a half-bridge arranged on a common substrate comprising
a first element arranged on the common substrate comprising at least a first semiconductor element and a first freewheeling component, a second element arranged on the common substrate comprising at least a second semiconductor element and a second freewheeling component, a first connecting lead coupled by an electrically conducting connection with the first semiconductor element, and a second connecting lead coupled with the second semiconductor element, wherein the first and second connecting leads, are at least partly arranged in parallel to each other, and a third a first hypothetical connecting lead, wherein the first, second and third connecting leads each have a base point facing the common substrate, and wherein a second hypothetical connecting line between centroids of the base points of the first and third connecting leads, and a connecting line between the centroids of the base points of the second and third connecting leads enclose an angle of greater than 0° - and less than or equal to 20°
. - View Dependent Claims (17, 18, 19, 20)
- and less than or equal to 20°
Specification