Antenna array with vane-supported elements

• US 7,280,082 B2
• Filed: 10/10/2003
• Issued: 10/09/2007
• Est. Priority Date: 10/10/2003
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Inventors: Theobold, David M., Saliga, Stephen V.
• Primary Examiner(s): Owens; Douglas W.
• Assistant Examiner(s): Vu; Jimmy
• Application Number:
  US10/682,983
• Publication Number:
  US 20050078046A1
• Time in Patent Office: 1,460 Days
• Field of Search: 343/762, 343/772, 343/778, 343/844, 343/846, 343/767, 343/770, 343/771, 343/795, 343/797, 343/702, 343/853
• US Class Current: 343/797
• CPC Class Codes: H01Q 1/12 Supports; Mounting means
• CPC Class Codes: H01Q 1/246 specially adapted for base stations
• CPC Class Codes: H01Q 21/062 using dipole aerials; H01Q21/067, H01Q21/068 take precedence

Abstract

A multiple element antenna array is disclosed in which a plurality of panels each support one or more antenna elements. One or more of the panels are preferably interlaced, so as to be affixed to a circuit board. The panels are configured so as to affix to the circuit board at a predetermined angle, which is preferably a right angle to the surface of the circuit board. Each antenna element includes a connection point for establishing a circuit board connection. The present multiple element antenna array is preferably incorporated into a wireless device; preferably an access point for a wireless local area network (WLAN). The wireless device further includes a radio transceiver comprising a plurality of circuit elements mounted on the circuit board.

Claims

1. A wireless device comprising:

a radio transceiver comprising a plurality of circuit elements mounted on a circuit board; and

a multiple element antenna array comprising;

a plurality of panels, each supporting at least one antenna element, for affixing to the circuit board at a predetermined angle, wherein at least two of the plurality of panels are interlaced with each other;

a connection point on each antenna element for establishing a connection to the circuit board; and

a non-radiating electronic components affixed to at least one panel;

wherein at least three panels are interlaced along a common axis of intersection, to form a star-shaped antenna array;

wherein the panels are formed of printed circuit board material with at least one antenna element formed thereon.

2. The wireless device of claim 1, wherein the non-radiating electronic components comprise at least one low-noise amplifier/power amplifier/switch for cooperating with a respective antenna element.

3. The wireless device of claim 2, wherein the wireless device is a wireless access point for a wireless local area network (WLAN).

4. The wireless device of claim 1, wherein the connection points comprise a connector for being received in a receptacle on the circuit board.

5. The wireless device of claim 1, wherein the connection points comprise a tap for being received into the circuit board.

6. The wireless device of claim 1, wherein the connection points are soldered onto the circuit board.

7. A wireless device comprising:

a radio transceiver comprising a plurality of circuit elements mounted on a circuit board;

and

a multiple element antenna array comprising;

a plurality of panels, each supporting at least one antenna element, for affixing to the circuit board at a predetermined angle, wherein at least two of the plurality of panels are interlaced with each other, and

a connection point on each antenna element for establishing a connection to the circuit board;

wherein the wireless device is a wireless access point for a wireless local area network (WLAN);

wherein the panels are formed of printed circuit board material with at least one antenna element formed thereon.

8. The wireless device of claim 7, further comprising non-radiating electronic components affixed to at least one panel.

9. The wireless device of claim 8, wherein the non-radiating electronic components comprise at least one low-noise amplifier/power amplifier/switch for cooperating with a respective antenna element.

10. The wireless device of claim 7, wherein at least two of the plurality of panels are interlaced at a right angle to form a cross-shaped antenna array, for affixing mutually perpendicular to the circuit board.

11. The wireless device of claim 7, wherein at least one panel is interlaced at right angles with at least a portion of the remaining panels, at respective positions having predetermined separations.

12. The wireless device of claim 7, wherein at least three panels are interlaced along a common axis of intersection, to form a star-shaped antenna array.

13. The wireless device of claim 7, wherein the connection points comprise a connector for being received in a receptacle on the circuit board.

14. The wireless device of claim 7, wherein the connection points comprise a tap for being received into the circuit board.

15. The wireless device of claim 7, wherein the connection points are soldered onto the circuit board.

16. A multiple element antenna array comprising:

a plurality of panels, each supporting at least one antenna element, for affixing to a circuit board at a predetermined angle; and

a connection point on each antenna element for establishing a circuit board connection;

wherein at least a two of the plurality of panels are interlaced with each other to form an antenna array affixed to the circuit board;

wherein at least three panels are interlaced along a common axis of intersection, to form a star-shaped antenna array; and

wherein the panels are formed of printed circuit board material.

17. The multiple element antenna array of claim 16, further comprising non-radiating electronic components affixed to at least one panel.

18. The multiple element antenna array of claim 16, wherein the connection points comprise a connector for being received in a receptacle on the circuit board.

19. The multiple element antenna array of claim 16, wherein the connection points comprise a tap for being received into the circuit board.

20. The multiple element antenna array of claim 19, wherein the connection points are soldered onto the circuit board.