Apparatus and methods for detecting overlay errors using scatterometry

• US 7,280,212 B2
• Filed: 02/23/2004
• Issued: 10/09/2007
• Est. Priority Date: 02/22/2003
• Status: Active Grant

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Levy, Ady, Friedmann, Michael, Smith, Ian, Adel, Michael E., Mieher, Walter D., Fielden, John, Golovanesky, Boris, Ghinovker, Mark, Bareket, Noah
• Primary Examiner(s): Toatley, Jr.; Gregory J.
• Assistant Examiner(s): Stock, Jr.; Gordon J.
• Application Number:
  US10/785,723
• Publication Number:
  US 20040257571A1
• Time in Patent Office: 1,324 Days
• Field of Search: None
• US Class Current: 356/401
• CPC Class Codes: G01N 2021/213 Spectrometric ellipsometry
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 7/70683 Mark designs
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric
• CPC Class Codes: G03F 9/7084 Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

Disclosed is a method of determining an overlay error between two layers of a multiple layer sample. For each of a plurality of periodic targets that each have a first structure formed from a first layer and a second structure formed from a second layer of the sample, a first optical signal is measured using a first ellipsometer or a first reflectometer and a second optical signal is measured using a second ellipsometer or a second reflectometer. There are predefined offsets between the first and second structures. An overlay error is determined between the first and second structures by analyzing the measured first and second optical signals from the periodic targets using a scatterometry overlay technique based on the predefined offsets.

Claims

1. A method of determining an overlay error between two layers of a multiple layer sample, the method comprising:

for each of a plurality of periodic targets that each have a first structure formed from a first layer and a second structure formed from a second layer of the sample, measuring a first optical signal using a first ellipsometer or a first reflectometer and a second optical signal using a second ellipsometer or a second reflectometer, wherein there are predefined offsets between the first and second structures; and

determining and storing, in memory, an overlay error between the first and second structures by analyzing the measured first and second optical signals from the periodic targets using a scatterometry overlay technique based on the predefined offsets, wherein the scatterometry overlay technique is a phase based technique that includes representing each of the first and second optical signals as a set of periodic functions having a plurality of known parameters and an unknown overlay error parameter and analyzing the set of periodic functions to solve for the unknown overlay error parameter to thereby determine the overlay error.

2. A method as recited in claim 1, wherein the first optical signal is measured using a first ellipsometer and the second optical signal is measured using a second ellipsometer which differs from the first ellipsometer.

3. A method as recited in claim 1, wherein the first optical signal is measured using a first reflectometer and the second optical signal is measured using a second reflectometer which differs from the first reflectometer.

4. A method as recited in claim 1, wherein the first optical signal is measured using an ellipsometer and the second optical signal is measured using a reflectometer.

5. A method as recited in claim 1, wherein the first ellipsometer or first reflectometer measures the first optical signal in a first direction and the second ellipsometer or second reflectometer measures the second optical signal in a second direction.

6. A method as recited in claim 1, wherein at least one of the first and second ellipsometer is a spectroscopic ellipsometer.

7. A method as recited in claim 1, wherein at least one of the first and second reflectometer is a polarized reflectometer.

8. A method as recited in claim 1, wherein the first and second optical signals are measured substantially simultaneously.

9. A method as recited in claim 1, wherein the first and second optical signals are measured sequentially.

10. A method as recited in claim 1, wherein the first and second optical signals are measured using different angles of incidence.

11. A method as recited in claim 1, wherein each first structure has a first center of symmetry and each second structure has a second center of symmetry and wherein the first center of symmetry and the second center of symmetry for each target are offset with respect to each other by a selected one of the predefined offsets.

12. A method as recited in claim 1, wherein the overlay error is determined and stored without comparing the measured optical signals to calibration data.