Interferometry systems and methods of using interferometry systems

• US 7,280,223 B2
• Filed: 04/22/2005
• Issued: 10/09/2007
• Est. Priority Date: 04/22/2004
• Status: Expired due to Fees

• Current Assignee: Zygo Corporation (Ametek Incorporated)
• Original Assignee: Zygo Corporation (Ametek Incorporated)
• Inventors: Hill, Henry A., Womack, Gary
• Primary Examiner(s): CONNOLLY, PATRICK J
• Application Number:
  US11/112,375
• Publication Number:
  US 20050248772A1
• Time in Patent Office: 900 Days
• Field of Search: 356/486, 356/487, 356/489, 356/492, 356/493, 356/498, 356/500, 356/508, 356/509, 356511-516
• US Class Current: 356/511
• CPC Class Codes: G01B 2290/15 Cat eye, i.e. reflection always parallel to incoming beam
• CPC Class Codes: G01B 2290/70 Using polarization in the interferometer
• CPC Class Codes: G01B 9/02018 Multipass interferometers, e.g. double-pass
• CPC Class Codes: G01B 9/02027 Two or more interferometric channels or interferometers
• CPC Class Codes: G01B 9/02059 Reducing effect of parasitic reflections, e.g. cyclic errors
• CPC Class Codes: G01B 9/02061 Reduction or prevention of effects of tilts or misalignment
• CPC Class Codes: G01B 9/02072 by calibration or testing of interferometer
• CPC Class Codes: G01B 9/02084 Processing in the Fourier or frequency domain when not imaged in the frequency domain
• CPC Class Codes: G01J 2009/0261 polarised
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position

Abstract

In general, in one aspect, the invention features methods that include interferometrically monitoring a distance between an interferometry assembly and a measurement object along each of three different measurement axes while moving the measurement object relative to the interferometry assembly, determining values of a first parameter and a second parameter for different positions of the measurement object from the monitored distances, wherein for a given position the first parameter is based on the monitored distances of the measurement object along each of the three different measurement axes at the given position, and for a given position the second parameter is based on the monitored distance of the measurement object along each of two of the measurement axes at the given position, and deriving information about a surface figure profile of the measurement object from the first and second parameter values.

Claims

1. A method, comprising:

interferometrically monitoring a distance between an interferometry assembly and a measurement object along each of three different measurement axes while moving the measurement object relative to the interferometry assembly;

determining values of a first parameter and a second parameter for different positions of the measurement object from the monitored distances, wherein for a given position the first parameter is based on the monitored distances of the measurement object along each of the three different measurement axes at the given position, and for a given position the second parameter is based on the monitored distance of the measurement object along each of two of the measurement axes at the given position;

deriving information about a surface figure profile of the measurement object from the first and second parameter values; and

outputting a signal based on the derived information.

2. The method of claim 1, wherein the second parameter is also based on the monitored distance of the measurement object along one of the measurement axes at another position.

3. The method of claim 1, wherein monitoring the distance between the interferometry assembly and the measurement object comprises simultaneously measuring a location of the measurement object along each of the measurement axes for each of the different positions of the measurement object.

4. The method of claim 1, wherein determining the value of the second parameter for each position of the measurement object includes calculating a difference between the monitored distance along two of the measurement axes for multiple different positions of the measurement object.

5. The method of claim 1, further comprising determining values of a third parameter for different positions of the measurement object, wherein for each position the third parameter is based on the distance of the measurement object along each of two of the measurement axes at that position and the distance of the measurement object along one of the measurement axes at another position.

6. The method of claim 5, wherein the information about the surface figure profile of the measurement object is derived also from the third parameter values.

7. The method of claim 5, wherein the values of the first parameter are determined for a first range of positions of the measurement object, the values of the second parameter are determined for a second range of positions of the measurement object, and the values of the third parameter are determined for a third range of positions of the measurement object.

8. The method of claim 7, wherein the first, second, and third ranges of positions of the measurement object are different.

9. The method of claim 5, deriving information about the surface figure profile of the measurement object comprises determining Fourier coefficients for a function characterizing the surface figure profile.

10. The method of claim 9, wherein the Fourier coefficients are determined from a discrete Fourier transform of the values of the first, second, and third parameters corrected for boundary offsets between the first, second, and third parameter values.

11. The method of claim 5, wherein the first parameter is a second difference parameter (SDP).

12. The method of claim 11, wherein the second and third parameters are extended second difference parameters (SDP^e).

13. The method of claim 5, wherein the first parameter is given by an expression comprising

[x_j(y)−

x_i(y)]−

η

[x_k(y)−

x_j(y)],

where x_n, corresponds to the distance between the interferometry assembly and the measurement position along the n-th measurement axis at position y with n=i, j, k, for i≠

j≠

k and η

is a non-zero constant.

14. The method of claim 13, wherein η

is selected so that the values of the expression are not sensitive to second order to rotations of the measurement object about an axis orthogonal to at least one of the three measurement axes.

15. The method of claim 14, wherein η

corresponds to a ratio of separation distances between the measurement axes.

16. The method of claim 13, wherein the second parameter is given by an expression comprising

[x_j(y)−

x_i(y)]+η

[x_j(y)−

x_i(y−

y′

)],

where y′

is a non-zero constant.

17. The method of claim 13, wherein the third parameter is given by an expression comprising

[x_k(y+y″

)−

x_j(y)]+η

[x_k(y)−

x_j(y)],

where y″

is a non-zero constant.

18. The method of claim 1, further comprising monitoring an orientation of the measurement object with respect to the measurement axes while moving the measurement object relative to the interferometry assembly.

19. The method of claim 18, wherein determining values of the second parameter comprises accounting for variations in the orientation of the measurement object.

20. The method of claim 1, further comprising using the information about the surface figure profile of the measurement object to improve the accuracy of measurements made using the interferometry assembly.

21. The method of claim 1, further comprising using a lithography tool to expose a substrate with radiation passing through a mask while interferometrically monitoring the distance between the interferometry assembly and the measurement object, wherein the position of the substrate or the mask relative to a reference frame is related to the distance between the interferometry assembly and the measurement object.

22. The method of claim 21, wherein the measurement object is attached to a wafer stage configured to support the wafer.

23. The method of claim 1, further comprising using the information about the surface figure profile of the measurement object to improve the accuracy of subsequent measurements made using the measurement object.

24. A lithography method for use in fabricating integrated circuits on a wafer, the method comprising:

supporting the wafer on a moveable stage;

imaging spatially patterned radiation onto the wafer;

adjusting the position of the stage; and

monitoring the position of the stage using the measurement object and using the information about the surface figure profile of the measurement object derived using the method of claim 1 to improve the accuracy of the monitored position of the stage.

25. A lithography method for use in the fabrication of integrated circuits comprising:

directing input radiation through a mask to produce spatially patterned radiation;

positioning the mask relative to the input radiation;

monitoring the position of the mask relative to the input radiation using the measurement object and using the information about the surface figure profile of the measurement object derived using the method of claim 1 to improve the accuracy of the monitored position of the mask; and

imaging the spatially patterned radiation onto a wafer.

26. A lithography method for fabricating integrated circuits on a wafer comprising:

positioning a first component of a lithography system relative to a second component of a lithography system to expose the wafer to spatially patterned radiation; and

monitoring the position of the first component relative to the second component using the measurement object and using the information about the surface figure profile of the measurement object derived using the method of claim 1 to improve the accuracy of the monitored position of the first component.

27. A method for fabricating integrated circuits, the method comprising the lithography method of claim 24.

28. A method for fabricating integrated circuits, the method comprising the lithography method of claim 25.

29. A method for fabricating integrated circuits, the method comprising the lithography method of claim 26.

30. A method for fabricating a lithography mask, the method comprising:

directing a write beam to a substrate to pattern the substrate;

positioning the substrate relative to the write beam; and

monitoring the position of the substrate relative to the write beam using the measurement object and using the information about the surface figure profile of the measurement object derived using the method of claim 1 to improve the accuracy of the monitored position of the substrate.

31. The method of claim 1, further comprising moving the measurement object relative to the interferometry assembly in response to the output signal.

36. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer;

an illumination system for imaging spatially patterned radiation onto the wafer;

a positioning system for adjusting the position of the stage relative to the imaged radiation; and

the apparatus of claim 31 for monitoring the position of the wafer relative to the imaged radiation.

37. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer; and

an illumination system including a radiation source, a mask, a positioning system, a lens assembly, and the apparatus of claim 31,

wherein during operation the source directs radiation through the mask to produce spatially patterned radiation, the positioning system adjusts the position of the mask relative to the radiation from the source, the lens assembly images the spatially patterned radiation onto the wafer, and the apparatus monitors the position of the mask relative to the radiation from the source.

40. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography system of claim 36; and

producing an integrated circuit from the wafer.

32. An apparatus, comprising:

a interferometer assembly configured to produce three output beams each including interferometric information about a distance between the interferometer and a measurement object along a respective axis; and

an electronic processor configured to determine values of a first parameter and a second parameter for different positions of the measurement object from the interferometric information,

wherein for a given position the first parameter is based on the distances of the measurement object along each of the respective measurement axes at the given position, and for a given position the second parameter is based on the monitored distance of the measurement object along two of the respective measurement axes at the given position and the monitored distance of the measurement object along one of the respective measurement axes at another position,

the electronic processor being further configured to derive information about a surface figure profile of the measurement object from the interferometric information.

33. The apparatus of claim 32, wherein the measurement object is a plane mirror measurement object.

34. The apparatus of claim 32, wherein the three output beams each include a component that makes one pass to the measurement object along a common beam path.

35. The apparatus of claim 32, further comprising a stage and wherein the interferometer assembly or measurement object are attached to the stage.

38. A beam writing system for use in fabricating a lithography mask, the system comprising:

a source providing a write beam to pattern a substrate;

a stage supporting the substrate;

a beam directing assembly for delivering the write beam to the substrate;

a positioning system for positioning the stage and beam directing assembly relative one another; and

the apparatus of claim 32 for monitoring the position of the stage relative to the beam directing assembly.

39. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography system of claim 35; and

producing an integrated circuit from the wafer.

41. A method, comprising:

interferometrically monitoring a distance between an interferometry assembly and a measurement object along each of three different measurement axes while moving the measurement object relative to the interferometry assembly;

determining values of a first parameter for different positions of the measurement object from the monitored distances, wherein for a given position the first parameter based on the monitored distance of the measurement object along each of two of the measurement axes at the given position and on the monitored distance of the measurement object along one of the measurement axes at another position;

deriving information about a surface figure profile of the measurement object from the first parameter values; and

outputting a signal based on the derived information.

42. The method of claim 41, futher comprising moving the measurement object relative to the interferometry assembly in response to the output signal.

43. The method of claim 41, further comprising using a lithography tool to expose a substrate with radiation passing through a mask while interferometrically monitoring the distance between the interferometry assembly and the measurement object, wherein the position of the substrate or the mask relative to a reference frame is related to the distance between the interferometry assembly and the measurement object.

44. The method of claim 43, wherein the measurement object is attached to a wafer stage configured to support the wafer.

45. The method of claim 41, further comprising using the information about the surface figure profile of the measurement object to improve the accuracy of subsequent measurements made using the measurement object.