Pump and electronic device having the pump

• US 7,280,357 B2
• Filed: 03/18/2005
• Issued: 10/09/2007
• Est. Priority Date: 04/28/2004
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro, Hata, Yukihiko
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/084,654
• Publication Number:
  US 20050243520A1
• Time in Patent Office: 935 Days
• Field of Search: None
• US Class Current: 361/699
• CPC Class Codes: F04D 29/5866 Cooling at last part of the working fluid in a heat exchanger
• CPC Class Codes: F04D 29/588 cooling or heating the machine F04D29/5886, F04D29/5893 take precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In one embodiment of the invention, a pump includes a pump housing, an impeller, and a motor. The pump housing has a pump chamber and a heat receiving plate to couple to a heat generating unit, such as a CPU. The impeller is provided in the pump chamber. The motor couples to the impeller to rotate it. A region of the heat receiving plate projects further outward than other regions to couple the heat receiving plate to the IC chip.

Claims

1. A pump comprising:

a pump housing including

a pump chamber, and

a heat receiving portion to couple to a heat generating unit, the heat receiving portion has a first region to mount the pump to a printed circuit board and a second region to couple to the heat generating unit, the second region projecting outward further than the first region to couple to the heat generating unit;

an impeller provided in the pump chamber; and

a motor coupled to the impeller, the motor to rotate the impeller to pump a liquid coolant.

2. A pump according to claim 1, wherein the second region is circularly projected outwards into a convex shape to couple to the heat generating unit.

3. A pump according to claim 1, wherein the heat receiving portion of the pump housing comprises a heat receiving plate.

4. A pump according to claim 3, wherein the heat receiving plate has a variable thickness that increases in the second region to project further outward than the first region to couple to the heat generating unit.

5. A pump according to claim 3, wherein the heat receiving plate has a constant thickness and is convexly shaped to project further outward than the first region to couple to the heat generating unit.

6. A pump according to claim 1, wherein the heat generating unit is a central processing unit, the central processing unit including an integrated circuit coupled to a substrate.

7. A cooling system for an electronic device comprising:

a heat dissipation portion to dissipate heat out from a coolant and away from a heat generating unit mounted in the electronic device;

a pump to transfer the coolant to the heat dissipation portion, the pump including

a pump housing having a pump chamber and a heat receiving portion to couple to the heat generating unit, the pump housing over the heat generating unit including a center region to couple to the heat generating unit to dissipate heat away from the heat generating unit into the coolant, the center region projecting outward further than other regions of the heat receiving portion to couple to the heat generating unit,

an impeller in the pump chamber, and

a motor coupled to the impeller, the motor to rotate the impeller in the pump chamber to pump the coolant;

a circulation path coupled between the pump and the heat dissipation portion, the circulation path to circulate the coolant between the pump and the heat dissipation portion to transfer the heat of the heat generating unit to the heat dissipation portion through the coolant; and

an electric fan located adjacent the heat dissipation portion, the electric fan to blow cooling air towards the heat dissipation portion.

8. A cooling system according to claim 7, wherein the center region is circularly projected outwards into a convex shape to couple to the heat generating unit.

9. A cooling system according to claim 7, wherein the heat receiving portion of the pump housing comprises a heat receiving plate, the heat receiving plate has a variable thickness that increases in the center region to project further outward than other regions to couple to the heat generating unit.

10. A cooling system according to claim 7, wherein the heat receiving portion of the pump housing comprises a heat receiving plate, the heat receiving plate has a constant thickness and is convexly shaped to project further outward than the other regions to couple to the heat generating unit.

11. An electronic device comprising:

a housing having a heat generating unit;

a heat dissipation portion in the housing to dissipate heat away from the heat generating unit;

a pump in the housing coupled to the heat generating unit, the pump to transfer a coolant to the heat dissipation portion, the pump including

a pump housing having a pump chamber and a heat receiving portion thermally coupled to the heat generating unit, the heat receiving portion including a first region to mount the pump over the heat generating unit and a second region coupled to the heat generating unit to dissipate heat away from the heat generating unit into the coolant, the second region shaped to project outward further than the first region of the heat receiving portion to couple to the heat generating unit,

an impeller in the pump chamber, and

a motor coupled to the impeller, the motor to

rotate the impeller; and

a circulation path coupled between the pump and the heat dissipation portion, the circulation path to circulate the coolant between the pump and the heat dissipation portion to transfer heat away from the heat generating unit and into the heat dissipation portion.

12. An electronic device according to claim 11, wherein the heat generating unit is a central processing unit and the electronic device is a laptop computer.

13. An electronic device according to claim 11, wherein the heat receiving portion is convexly shaped to project outward from the pump to couple to the heat generating unit.

14. An electronic device according to claim 11, further comprising:

a securing means to mount the pump in the housing.

15. An electronic device according to claim 11, further comprising:

a printed circuit board in the housing; and

mounting means to mount the pump in the housing to the printed circuit board over the heat generating unit.

16. An electronic device according to claim 11, wherein

the circulation path includes a first piping to receive hot coolant from the pump and to transfer the hot coolant to the heat dissipation portion,

the circulation path includes a second piping to receive cooler coolant from the heat dissipation portion and to transfer the cooler coolant to the pump.

17. An electronic device according to claim 11, wherein

the pump housing further has a reservoir tank to fill with liquid coolant, and

the heat dissipation portion has dissipation fins to transfer heat out of the liquid coolant.

18. An electronic device according to claim 11, further comprising:

an electric fan in the housing, the electric fan to blow cooling air to the heat dissipation portion.

19. An electronic device according to claim 11, wherein the heat receiving portion of the pump housing comprises a heat receiving plate, the heat receiving plate has a variable thickness that increases in the second region to project further outward than the first region to couple to the heat generating unit.

20. An electronic device according to claim 11, wherein the heat receiving portion of the pump housing comprises a heat receiving plate, the heat receiving plate has a constant thickness and is convexly shaped to project the second region further outward than the first region to couple to the heat generating unit.