Semiconductor laser beam device

• US 7,280,572 B2
• Filed: 03/24/2003
• Issued: 10/09/2007
• Est. Priority Date: 03/25/2002
• Status: Active Grant

• Current Assignee: Panasonic Semiconductor Solutions Co., Ltd. (Winbond Electronics Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation), Tottori Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Honda, Shoji
• Primary Examiner(s): Harvey; Minsun Oh
• Assistant Examiner(s): Nguyen; Phillip
• Application Number:
  US10/503,938
• Publication Number:
  US 20050089070A1
• Time in Patent Office: 1,660 Days
• Field of Search: 372/34, 372/36
• US Class Current: 372/36
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01S 5/02212 Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
• CPC Class Codes: H01S 5/02253 using lenses
• CPC Class Codes: H01S 5/024 Arrangements for thermal management

Abstract

A semiconductor laser beam device, comprising a stem type package having a base part and a heat sink part, wherein the heat sink part is cylindrically formed so as to be concentric to the base part, a groove is formed along the axial direction of the heat sink part, and a semiconductor laser beam element is disposed at the bottom part of the inner wall surfaces of the groove whereby the radiating capability of the semiconductor laser beam device can be increased by increasing the volume of the heat sink part, and the element can be protected by the groove.

Claims

1. A semiconductor laser device comprising:

a semiconductor laser element having an optical axis;

a metal heat sink having a groove extending in a same direction as the optical axis, the groove being defined by at least one wall located on a left side relative to the optical axis and a right side relative to the optical axis, the at least one wall being integrally formed in the heat sink;

a first bonding wire electrically connected to one electrode of the semiconductor laser element; and

a second bonding wire electrically connected to another electrode of the semiconductor laser element,

wherein the semiconductor laser element, the first bonding wire and the second bonding wire are arranged in the groove, and

wherein an outer bottom surface of the heat sink is flat and has an area larger than an area of an inner bottom surface of the groove.

3. A semiconductor laser device according to claim 1, wherein the walls are formed on the left side and the right side relative to the optical axis.

4. A semiconductor laser device according to one of claims 1 and 2, wherein the semiconductor laser element is completely housed in the groove.

5. A semiconductor laser device according to one of claims 1 and 2, wherein the semiconductor laser element, the first bonding wire and the second bonding wire are completely housed in the groove.

6. A semiconductor laser device according to one of claims 1 and 2, wherein the at least one wall extends to a height higher than the semiconductor laser element.

9. A semiconductor laser device according to one of claims 1 and 2, wherein the heat sink has a tapered surface formed along an outer edge of a tip end thereof.

10. A semiconductor laser device according to one of claims 1 and 2, wherein the heat sink has a tip end thereof formed into a spherical surface.

11. A semiconductor laser device according to one of claims 1 and 2, wherein a flat-plate-shaped optical element is attached to a front end surface of the heat sink.

12. A semiconductor laser device according to one of claims 1 and 2, wherein a spherical optical element is attached to a front end surface of the heat sink.

2. A semiconductor laser device comprising:

a semiconductor laser element having an optical axis and being arranged in a package that includes a metal base and a heat sink, wherein a groove is defined in the package by at least one wall located on a left side relative to the optical axis and at least one wall located on a right side relative to the optical axis;

a first bonding wire electrically connected to one electrode of the semiconductor laser element; and

a second bonding wire electrically connected to another electrode of the semiconductor laser element,

wherein the semiconductor laser element, the first bonding wire, and the second bonding wire are arranged in the groove, and

wherein an outer bottom surface of the heat sink is flat and has an area larger than an area of an inner bottom surface of the groove.

7. A semiconductor laser device according to claim 2, wherein a lead pin is provided that, at one end thereof, penetrates the base, and the lead pin is, at the other end thereof, located in the groove.

8. A semiconductor laser device according to claim 2, wherein a lead pin is provided that, at one end thereof, penetrate the base, and the lead pin is, at the one end thereof, located in the groove.

13. A semiconductor laser device according to claim 2, wherein the base and the heat sink are formed of a same metal.

14. A semiconductor laser device comprising a semiconductor laser element and a columnar, metal heat sink having a flat surface that is parallel relative to an optical axis of the semiconductor laser element and on which the semiconductor laser element is placed, wherein the heat sink has a wall formed integrally therewith at least to one of a left-hand side and a right-hand side of the flat surface relative to the optical axis, wherein a summit of the wall is located higher than at least one bonding wire connected to the semiconductor laser element, and wherein an outer bottom surface of the heat sink is flat and has an area larger than a flat surface area on which the semiconductor laser element is placed.