Semiconductor device, manufacturing method and apparatus for the same
First Claim
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1. A semiconductor device manufacturing method, comprising the steps of:
- forming, on a wiring layer, an under-bump layer, including first metal which is to form a first intermetallic compound at an interface through reaction with alloy solder;
forming a metal layer made of second metal which is to form a second intermetallic compound through reaction with the alloy solder;
supplying the alloy solder; and
forming an alloy layer at an interface between the under-bump layer and the alloy solder by cooling after temporary fusing of the alloy solder, wherein the alloy layer is a combination of the first intermetallic compound and the second intermetallic compound.
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Abstract
A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and diffusion of tin into tin-based lead free solder is thinly formed on a UBM layer. The tin-based solder is supplied in solder paste or solder ball form. A combined solder alloy layer composed of a combination of intermetallic compounds, one of tin and the solder alloy making layer, and one of tin and the UBM layer, is formed by heating and melting.
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Citations
20 Claims
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1. A semiconductor device manufacturing method, comprising the steps of:
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forming, on a wiring layer, an under-bump layer, including first metal which is to form a first intermetallic compound at an interface through reaction with alloy solder; forming a metal layer made of second metal which is to form a second intermetallic compound through reaction with the alloy solder; supplying the alloy solder; and forming an alloy layer at an interface between the under-bump layer and the alloy solder by cooling after temporary fusing of the alloy solder, wherein the alloy layer is a combination of the first intermetallic compound and the second intermetallic compound. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification