Method and system for testing RAM redundant integrated circuits
First Claim
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1. Method of production testing a random access memory (RAM) redundant integrated circuit die fabricated on a wafer, said method comprising the steps of:
- at the wafer level,testing said RAM redundant integrated circuit die;
identifying a failed element of the redundant RAM of said integrated circuit die; and
replacing said failed element with a redundant element in the redundant RAM of said integrated circuit die;
Thereafter, sectioning said tested die from the wafer;
packaging said sectioned die in an integrated circuit package;
at the package level,performing a test on said packaged integrated circuit die;
identifying a failed element of the redundant RAM of said packaged integrated circuit die; and
replacing said failed element with a redundant element in the redundant RAM of said packaged integrated circuit die;
wherein this step comprises electrically blowing fuses in the redundant RAM of the packaged integrated circuit die to replace the failed element with a redundant element.
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Abstract
System and method of testing a packaged random access memory (RAM) redundant integrated circuit die comprising: identifying a failed element in the redundant RAM of the packaged integrated circuit die; and replacing the failed element with a redundant element in the redundant RAM of the packaged integrated circuit die.
29 Citations
18 Claims
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1. Method of production testing a random access memory (RAM) redundant integrated circuit die fabricated on a wafer, said method comprising the steps of:
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at the wafer level, testing said RAM redundant integrated circuit die; identifying a failed element of the redundant RAM of said integrated circuit die; and replacing said failed element with a redundant element in the redundant RAM of said integrated circuit die; Thereafter, sectioning said tested die from the wafer; packaging said sectioned die in an integrated circuit package; at the package level, performing a test on said packaged integrated circuit die; identifying a failed element of the redundant RAM of said packaged integrated circuit die; and replacing said failed element with a redundant element in the redundant RAM of said packaged integrated circuit die;
wherein this step comprises electrically blowing fuses in the redundant RAM of the packaged integrated circuit die to replace the failed element with a redundant element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. Method of testing a packaged random access memory (RAM) redundant integrated circuit die comprising:
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identifying a failed element in the redundant RAM of said packaged integrated circuit die; and replacing said failed element with a redundant element in the redundant RAM of said packaged integrated circuit die;
wherein this step comprises electrically blowing fuses in the redundant RAM of the packaged integrated circuit die to replace the failed element with a redundant element. - View Dependent Claims (11, 12, 13, 14, 15)
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16. System for testing a packaged random access memory (RAM) redundant integrated circuit die comprising:
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a tester unit coupled to said packaged integrated circuit die and operative to identify a failed element in the redundant RAM of said packaged integrated circuit die; and a programmer coupled to said tester unit and packaged integrated circuit die and operative to replacing said failed element with a redundant element in the redundant RAM of said packaged integrated circuit die;
wherein the programmer is operative to electrically blow fuses in the redundant RAM of the packaged integrated circuit die to replace the failed element with a redundant element. - View Dependent Claims (17)
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18. System for testing a packaged random access memory (RAM) redundant integrated circuit die comprising:
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means for identifying a failed element in the redundant RAM of said packaged integrated circuit die; and means for electrically blowing fuses in the redundant RAM of the packaged integrated circuit die to replace the failed element with a redundant element.
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Specification