Nozzle arrangement including an actuator

• US 7,284,836 B2
• Filed: 01/12/2005
• Issued: 10/23/2007
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): JACKSON, JUANITA DIONNE
• Application Number:
  US11/033,122
• Publication Number:
  US 20050140726A1
• Time in Patent Office: 1,014 Days
• Field of Search: 347/20, 347/44, 347/47, 347/54, 347/56, 347 61- 65, 347/67, 347 57- 59, 60527-529
• US Class Current: 347/54
• CPC Class Codes: B05D 2201/00 Polymeric substrate or laminate
• CPC Class Codes: B05D 3/08 by flames
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04571 detecting viscosity
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 : dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1639 : sacrificial molding
• CPC Class Codes: B41J 2/1642 : thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 : thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2002/14419 : Manifold
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: Y10T 29/49345 : Catalytic device making

Abstract

A nozzle arrangement 1 for use in an ink jet print head, the nozzle arrangement 1 comprising a substrate, a nozzle chamber 2 positioned at least partially on the substrate, a channel 3, in fluid communication with the nozzle chamber 2, through the substrate, and, an actuator 6 including an actuator arm 8 and a paddle 7, the paddle 7 positioned within the nozzle chamber 2 and at least partially overlying the channel 3.

Claims

1. A nozzle arrangement for use in an ink jet print head, the nozzle arrangement comprising:

a substrate;

a nozzle chamber positioned at least partially on the substrate;

a channel, in fluid communication with the nozzle chamber, through the substrate; and

,

a thermal actuator including an actuator arm and a paddle, the paddle positioned within the nozzle chamber and at least partially overlying the channel.

2. The nozzle arrangement as claimed in claim 1, wherein the channel is an ink supply channel.

3. The nozzle arrangement as claimed in claim 1, wherein the nozzle chamber is provided with a nozzle rim.

4. The nozzle arrangement as claimed in claim 1, wherein the paddle is of circular form.

5. The nozzle arrangement as claimed in claim 1, wherein the actuator arm is pivotal about a post positioned on the substrate.

6. The nozzle arrangement as claimed in claim 1, wherein the actuator arm is formed between a first layer of material and a second layer of material.

7. The nozzle arrangement as claimed in claim 6, wherein the first layer of material and the second layer of material are formed of conductive material.

8. The nozzle arrangement as claimed in claim 7, wherein the first layer of material and the second layer of material are formed of titanium nitride.

9. The nozzle arrangement as claimed in claim 6, wherein the second layer of material forms part of a conductive circuit.

10. The nozzle arrangement as claimed in claims 5 and 6, wherein the second layer of material has a thinned portion near the post.

11. The nozzle arrangement as claimed in claim 1, including an ink spreading prevention rim placed adjacent the nozzle chamber.

12. The nozzle arrangement as claimed in claim 11, wherein the ink spreading prevention rim includes a pit, the pit forming an annulus about the nozzle chamber.