LED light module assembly
First Claim
1. An LED lighting module assembly, comprising:
- at least one LED that is operatively connected to a first surface of an LED carrier, said LED carrier having a carrier metallization layer on a second surface;
a flexible circuit board comprising a first metallization layer, a dielectric layer and a second metallization layer, the dielectric layer located between the first metallization layer and the second metallization layer, the first metallization layer having defined thereon at least one LED attachment pad, the LED attachment pad having at least one via through the dielectric layer, the via having a via metallization layer which is joined to the first metallization layer and the second metallization layer;
a first means for joining the carrier metallization layer to the LED attachment pad, which means is operative to provide a preferred thermal conduction path between the LED and the LED attachment pad;
a metal heat sink having a base and a plurality of raised cooling fins extending away from the base, the fins being spaced apart from one another; and
a second means for joining a portion of the second metallization which is proximate to the LED attachment pad and the via to the metal heat sink, which means is operative to provide a preferred thermal conduction path between the second metallization layer and the metal heat sink.
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Accused Products
Abstract
An LED light module assembly for use with high power, high light output LED'"'"'s includes a thin flexible circuit board with surface mounted LED'"'"'s and other electronic components which is attached to a metal heat sink using a layer of a thermally conductive adhesive, such as a thermally conductive epoxy adhesive. A conduction path is provided from the LED carrier through the flexible circuit board by the incorporation of one or more thermally conductive vias in the region of the attachment pad used to bond the LED to the flexible circuit board. These vias provide a conduction path from the back side of the LED carrier through the circuit board to the thermally conductive adhesive and heat sink. The LED light module assembly has the capacity to dissipate between about 10-14 W of power without exceeding a maximum LED junction temperature of about 125° C.
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Citations
23 Claims
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1. An LED lighting module assembly, comprising:
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at least one LED that is operatively connected to a first surface of an LED carrier, said LED carrier having a carrier metallization layer on a second surface; a flexible circuit board comprising a first metallization layer, a dielectric layer and a second metallization layer, the dielectric layer located between the first metallization layer and the second metallization layer, the first metallization layer having defined thereon at least one LED attachment pad, the LED attachment pad having at least one via through the dielectric layer, the via having a via metallization layer which is joined to the first metallization layer and the second metallization layer; a first means for joining the carrier metallization layer to the LED attachment pad, which means is operative to provide a preferred thermal conduction path between the LED and the LED attachment pad; a metal heat sink having a base and a plurality of raised cooling fins extending away from the base, the fins being spaced apart from one another; and a second means for joining a portion of the second metallization which is proximate to the LED attachment pad and the via to the metal heat sink, which means is operative to provide a preferred thermal conduction path between the second metallization layer and the metal heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification