Electric field reducing thrust plate

• US 7,285,195 B2
• Filed: 06/24/2004
• Issued: 10/23/2007
• Est. Priority Date: 06/24/2004
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Zheng, Bo, Herchen, Harald, Pang, Lily L., Lubomirsky, Dmitry
• Primary Examiner(s): King; Roy V.
• Assistant Examiner(s): Smith; Nicholas A.
• Application Number:
  US10/877,137
• Publication Number:
  US 20050284754A1
• Time in Patent Office: 1,216 Days
• Field of Search: 204/297.01, 204/286.1, 204/224.R, 204/287, 205/96
• US Class Current: 204/297.01
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 7/12 Semiconductors
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition

Abstract

A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.

Claims

1. A contact ring assembly for supporting a substrate in an electrochemical processing system, comprising:

an annular contact ring configured to support and electrically contact a processing surface of the substrate;

a thrust plate movably positioned to engage a backside of the substrate positioned on the contact ring; and

a lip seal member extending from an outer perimeter of the thrust plate and contacting an inner surface of the contact ring to prevent fluid flow therebetween, wherein the lip seal member comprises at least one bubble release channel formed therethrough.

2. The contact ring of claim 1, wherein the lip seal member comprises a base member affixed to the thrust plate assembly and a flexible extending seal member.

3. The contact ring of claim 1, wherein the at least one bubble release channels are evenly spaced between a plurality of electrical contact pins extending from the contact ring.

4. The contact ring of claim 1, wherein the lip seal member comprises an elastomer selected from the group consisting of fluoroelastomer (FKM), perfluoroelastomer (FFKM), tetrafluoroethylene-perfluoro (alkyl vinyl ether) copolymer (PFA), polytetrafluoro ethylene (PTFE), polyvinylidene difluoride (PVDF), and combinations thereof.

5. The contact ring of claim 1, further comprising a backside substrate seal positioned between a backside of the substrate and the thrust plate.

6. The contact ring of claim 2, wherein the flexible extending seal member is positioned to engage a substantially horizontal surface of the contact ring.

7. The contact ring of claim 2, wherein the flexible extending seal member is configured to substantially prevent electric field from traveling therethrough while allowing gas bubbles to pass therethrough.

8. A contact ring assembly for supporting a substrate in an electrochemical processing system, comprising:

an annular contact ring having a plurality of substrate supporting electrical contact pins extending therefrom;

a thrust plate assembly movably positioned to engage a substrate positioned on the contact pins;

an electric field barrier positioned between an outer perimeter of the thrust plate and a surface of the contact ring; and

at least one bubble release channel formed into the electric field barrier.

9. The contact ring assembly of claim 8, wherein the at least one bubble release channel is positioned above the electrical contact pins and equally spaced therefrom.

10. The contact ring assembly of claim 8, wherein the electric field barrier comprises a seal member longitudinally extending from a base that is attached to a perimeter of the thrust plate.

11. The contact ring assembly of claim 10, wherein the longitudinally extending sealing member is vertically flexible.

12. The contact ring assembly of claim 8, wherein the electric field barrier comprises an elastomer selected from the group comprising fluoroelastomer (FKM), perfluoroelastomer (FFKM), tetrafluoroethylene-perfluoro (alkyl vinyl ether) copolymer (PFA), polytetrafluoro ethylene (PTFE), polyvinylidene difluoride (PVDF), and combinations thereof.

13. The contact ring assembly of claim 11, wherein the seal member of the electric filed barrier is positioned to contact a substantially horizontal surface of the contact ring.

14. The contact ring assembly of claim 11, wherein the seal member of the electric filed barrier is positioned to contact a sloped surface of the contact ring.

15. A method for processing a substrate in an electrochemical processing system, comprising positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member, the field barrier having at least one bubble release channel formed therethrough.

16. The method of claim 15, wherein the at least one bubble release channel is positioned above electrical contact pins extending from the substrate supporting member and equally spaced therebetween.

17. The method of claim 15, wherein the electric field barrier comprises a base attached to the thrust plate and a longitudinally extending sealing member.

18. The method of claim 15, wherein the electric field barrier is manufactured from a material configured to substantially prevent electric field from passing therethrough.

19. The method of claim 18, wherein the electric field barrier comprises an elastomer selected from the group consisting of fluoroelastomer (FKM), perfluoroelastomer (FFKM), tetrafluoroethylene-perfluoro (alkyl vinyl ether) copolymer (PFA), polytetrafluoro ethylene (PTFE), polyvinylidene difluoride (PVDF), and combinations thereof.

20. The method of claim 19, wherein the electric field barrier is configured to minimize an electric field path to the backside and bevel of the substrate.