Stackable ceramic FBGA for high thermal applications
First Claim
Patent Images
1. A method for forming an assembly comprising:
- obtaining a first carrier having a plurality of sides and a cavity, a frustoconical surface on a portion of each side of the plurality of sides for nesting with a second assembly, a lip on a portion of a bottom surface of each side of the plurality of sides for nesting with a third assembly, and a plurality of circuits located in a portion of the cavity;
placing a semiconductor device having a plurality of bond pads located within the cavity of the first carrier;
forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device;
filling a portion of the cavity in the first carrier using an encapsulant material; and
placing a second connector material located in the first carrier.
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Abstract
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
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Citations
41 Claims
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1. A method for forming an assembly comprising:
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obtaining a first carrier having a plurality of sides and a cavity, a frustoconical surface on a portion of each side of the plurality of sides for nesting with a second assembly, a lip on a portion of a bottom surface of each side of the plurality of sides for nesting with a third assembly, and a plurality of circuits located in a portion of the cavity; placing a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device; filling a portion of the cavity in the first carrier using an encapsulant material; and placing a second connector material located in the first carrier. - View Dependent Claims (2, 3, 4)
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5. An assembly method comprising:
- forming a first carrier having a plurality of sides, an upper surface, a lower surface, a cavity, a frustoconical surface on a portion of each side of the plurality of sides for nesting with a second assembly, a lip on a portion of a bottom surface of each side of the plurality of sides for nesting with a third assembly, a plurality of circuits located in a portion of the cavity, at least one circuit of the plurality of circuits located in a portion of the cavity extending to at least one contact pad of a plurality of contact pads on the upper surface, a plurality of contact pads on the lower surface, and a plurality of internal circuits extending between at least one of the plurality of contact pads on the upper surface and at least one of the plurality of contact pads on the lower surface;
locating a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; and forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device. - View Dependent Claims (6, 7, 8, 9, 10, 11)
- forming a first carrier having a plurality of sides, an upper surface, a lower surface, a cavity, a frustoconical surface on a portion of each side of the plurality of sides for nesting with a second assembly, a lip on a portion of a bottom surface of each side of the plurality of sides for nesting with a third assembly, a plurality of circuits located in a portion of the cavity, at least one circuit of the plurality of circuits located in a portion of the cavity extending to at least one contact pad of a plurality of contact pads on the upper surface, a plurality of contact pads on the lower surface, and a plurality of internal circuits extending between at least one of the plurality of contact pads on the upper surface and at least one of the plurality of contact pads on the lower surface;
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12. An assembly method comprising:
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forming a substrate having an upper surface, a lower surface, and a plurality of circuits on the upper surface thereof and a plurality of circuits on the lower surface thereof; forming a first carrier having a plurality of sides, an upper surface, a lower surface, a cavity, a frustoconical surface on a portion of each side for nesting with a side of a second carrier, a lip on a portion of a bottom surface of each side for nesting with a surface of a third carrier, a plurality of circuits located in a portion of the cavity, at least one circuit of the plurality of circuits located in a portion of the cavity extending to at least one contact pad of a plurality of contact pads on the upper surface, a plurality of contact pads on the lower surface, and a plurality of internal circuits extending between at least one of the plurality of contact pads on the upper surface and at least one of the plurality of contact pads on the lower surface; locating a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device; and attaching the first carrier to the upper surface of the substrate by forming at least one second connector connected to at least one contact pad of the plurality of contact pads on the lower surface of the first carrier and at least one circuit of the plurality of circuits on the upper surface of the substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A method for forming an assembly comprising:
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forming a substrate having an upper surface, a lower surface, a plurality of circuits on the upper surface thereof, and a plurality of circuits on the lower surface thereof; forming a first carrier having a plurality of sides, a cavity, a frustoconical surface on a portion of each side for nesting with a second carrier, a lip on a portion of a bottom surface of each side for nesting with a bottom surface of a third carrier, and a plurality of circuits located in a portion of the cavity; placing a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device; placing a second connector material located in the first carrier; forming at least one second connector connected to the second connector material in the first carrier and at least one circuit of the plurality of circuits on the upper surface of the substrate. - View Dependent Claims (21, 22, 23)
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24. A method of stacking a plurality of semiconductor devices using carriers for forming an assembly comprising:
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forming a first carrier having a plurality of sides, a cavity, a frustoconical surface on a portion of each side for nesting with another side of a second carrier, a lip on a portion of a bottom surface of each side for nesting with a side of a third carrier, and a plurality of circuits located in a portion of the cavity; placing a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device; filling a portion of the cavity in the first carrier using an encapsulant material; and placing a second connector material located in the first carrier. - View Dependent Claims (25, 26, 27)
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28. A method of stacking a plurality of semiconductor devices using carriers for forming an assembly comprising:
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forming a first carrier having a plurality of sides, an upper surface, a lower surface, a cavity, a frustoconical surface on a portion of each side for nesting with another side of a second carrier, a lip on a portion of a bottom surface for nesting with another surface of a third carrier, a plurality of circuits located in a portion of the cavity, at least one circuit of the plurality of circuits located in a portion of the cavity extending to at least one contact pad of a plurality of contact pads on the upper surface, a plurality of contact pads on the lower surface, and a plurality of internal circuits extending between at least one of the plurality of contact pads on the upper surface and at least one of the plurality of contact pads on the lower surface; locating a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; and forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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35. A method for stacking a plurality of semiconductor devices using carriers for forming an assembly comprising:
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obtaining a substrate having an upper surface, a lower surface, and a plurality of circuits on the upper surface thereof and a plurality of circuits on the lower surface thereof; obtaining a first carrier having a plurality of sides, an upper surface, a lower surface, a cavity, a frustoconical surface on a portion of each side for nesting with a portion of a side of a second carrier, a lip on a portion of a bottom surface of each side for nesting with a portion of a surface of a third carrier, a plurality of circuits located in a portion of the cavity, at least one circuit of the plurality of circuits located in a portion of the cavity extending to at least one contact pad of a plurality of contact pads on the upper surface, a plurality of contact pads on the lower surface, and a plurality of internal circuits extending between at least one of the plurality of contact pads on the upper surface and at least one of the plurality of contact pads on the lower surface; locating a semiconductor device having a plurality of bond pads located within the cavity of the first carrier; forming a first connector between at least one circuit of the plurality of circuits located in the portion of the cavity of the first carrier and at least one bond pad of the plurality of bond pads of the semiconductor device; and attaching the first carrier to the upper surface of the substrate by forming at least one second connector connected to at least one contact pad of the plurality of contact pads on the lower surface of the first carrier and at least one circuit of the plurality of circuits on the upper surface of the substrate. - View Dependent Claims (36, 37, 38, 39, 40, 41)
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Specification