Rapid thermal processing lamp and method for manufacturing the same
First Claim
Patent Images
1. A thermal processing equipment for heating a substrate, comprising:
- plural inductively coupled filaments including first and second inductively coupled filaments configured to heat the substrate via radiant heating while separated from the substrate by a gap and not physically connected to a power source; and
at least one induction coil configured to inductively heat the first and second inductively coupled filaments.
1 Assignment
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Accused Products
Abstract
A method and system for inductively coupling energy to a heating filament (7A′, 7B′, 7C′, 7A, 7B, 7C) in a thermal processing environment. By applying AC power to a coil antenna (11) and inductive coupling to a filament (e.g., a halogen lamp filament), a number of connections that are subject to fatigue is reduced, thereby increasing the reliability of the heater (2A, 2B). Such an environment can be used to process semiconductor wafers (3) and liquid crystal displays.
21 Citations
28 Claims
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1. A thermal processing equipment for heating a substrate, comprising:
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plural inductively coupled filaments including first and second inductively coupled filaments configured to heat the substrate via radiant heating while separated from the substrate by a gap and not physically connected to a power source; and at least one induction coil configured to inductively heat the first and second inductively coupled filaments. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A thermal processing equipment for heating a substrate, comprising:
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a first inductively coupled filament configured to heat the substrate; a first cavity, between first and second isolation plates, configured to receive the first inductively coupled filament; and hairpins configured to support the first inductively coupled filament away from the first and second isolation plates. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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25. A thermal processing equipment for heating a substrate, comprising:
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first and second heating means for heating the substrate via radiant heating while separated from the substrate by a gap; coupling means for inductively coupling power to the first and second heating means in order to heat the heating means; and means for reflecting at least one of a light and a heat towards the substrate. - View Dependent Claims (26, 27, 28)
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Specification