Power MOS device
First Claim
1. A semiconductor device comprising:
- a drain;
a body disposed over the drain, having a body top surface;
a source embedded in the body, extending downward from the body top surface into the body;
a gate trench extending through the source and the body into the drain;
a gate disposed in the gate trench; and
a source body contact trench having a trench wall, a trench bottom, and an anti-punch through implant that is disposed along the trench wall;
wherein;
the source body contact trench includes conductive material that is disposed within the source body contact trench;
the conductive material is at least in part in contact with the source and at least in part in contact with the body; and
the anti-punch through implant is disposed along at least a section of the trench wall but not along the trench bottom.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device comprises a drain, a body disposed over the drain, having a body top surface, a source embedded in the body, extending downward from the body top surface into the body, a gate trench extending through the source and the body into the drain, a gate disposed in the gate trench, a source body contact trench having a trench wall and an anti-punch through implant that is disposed along the trench wall.
A method of fabricating a semiconductor device comprises forming a hard mask on a substrate having a top substrate surface, forming a gate trench in the substrate, through the hard mask, depositing gate material in the gate trench, removing the hard mask to leave a gate structure, forming a source body contact trench having a trench wall and forming an anti-punch through implant.
56 Citations
8 Claims
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1. A semiconductor device comprising:
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a drain; a body disposed over the drain, having a body top surface; a source embedded in the body, extending downward from the body top surface into the body; a gate trench extending through the source and the body into the drain; a gate disposed in the gate trench; and a source body contact trench having a trench wall, a trench bottom, and an anti-punch through implant that is disposed along the trench wall;
wherein;the source body contact trench includes conductive material that is disposed within the source body contact trench; the conductive material is at least in part in contact with the source and at least in part in contact with the body; and the anti-punch through implant is disposed along at least a section of the trench wall but not along the trench bottom. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification