Process for producing microelectromechanical components and a housed microelectromechanical component
First Claim
1. A process for producing microelectromechanical components from a substrate having a first side and a second side which issubstantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the steps ofsecuring at least one support which is suitable for ensuring the mechanical stability of the substrate to the first side of the substrate,thinning the substrate material,introducing at least one electrically conductive passage into the substrate,whereby said step of introducing at least one electrically conductive passage into the substrate is carried out subsequently to said step of thinning the substrate material, andwherein the step of providing the at least one electrically conductive passage comprises the step of producing a recess by removing substrate material and filling said recess with a conductive epoxy.
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Accused Products
Abstract
A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.
38 Citations
40 Claims
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1. A process for producing microelectromechanical components from a substrate having a first side and a second side which is
substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the steps of securing at least one support which is suitable for ensuring the mechanical stability of the substrate to the first side of the substrate, thinning the substrate material, introducing at least one electrically conductive passage into the substrate, whereby said step of introducing at least one electrically conductive passage into the substrate is carried out subsequently to said step of thinning the substrate material, and wherein the step of providing the at least one electrically conductive passage comprises the step of producing a recess by removing substrate material and filling said recess with a conductive epoxy.
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10. A process for producing microelectromechanical components from a substrate having a first side and a second side which is
substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the steps of securing at least one support which is suitable for ensuring the mechanical stability of the substrate to the first side of the substrate, thinning the substrate material, introducing at least one electrically conductive passage into the substrate, whereby said step of introducing at least one electrically conductive passage into the substrate is carried out subsequently to said step of thinning the substrate material, and wherein the step of introducing the at least one electrically conductive passage comprises the step of at least one of doping and ion implantation.
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11. A process for producing microelectromechanical components from a substrate having a first side and a second side which is
substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the steps of securing at least one support which is suitable for ensuring the mechanical stability of the substrate to the first side of the substrate, thinning the substrate material, introducing at least one electrically conductive passage into the substrate, whereby said step of introducing at least one electrically conductive passage into the substrate is carried out subsequently to said step of thinning the substrate material, said process further comprising the step of structuring the support.
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27. A process for producing microelectromechanical components from a substrate having a first side and a second side which is
substantially opposite from the first side, at least the first side having at least one microelectromechanical element, comprising the steps of securing at least one support which is suitable for ensuring the mechanical stability of the substrate to the first side of the substrate, thinning the substrate material, introducing at least one electrically conductive passage into the substrate, whereby said step of introducing at least one electrically conductive passage into the substrate is carried out subsequently to said step of thinning the substrate material, wherein the at least one conductive passage is introduced from the second side of the substrate.
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28. A microelectromechanical component comprising a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side comprising at least one microelectromechanical element and at least one support which is connected to the first side of the substrate,
wherein the substrate has at least one electrically conductive passage, connecting the first side to the second side, and wherein the substrate is thinned, the mechanical stability of the thinned substrate being ensured by means of the support, whereby said conductive passage is introduced into the thinned substrate, and wherein the support has at least one optical element.
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38. A microelectromechanical component comprising a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side comprising at least one microelectromechanical element and at least one support which is connected to the first side of the substrate, wherein the substrate has at least one electrically conductive passage, connecting the first side to the second side and wherein the substrate is thinned, the mechanical stability of the thinned substrate being ensured by means of the support, whereby said conductive passage is introduced into the thinned substrate,
said microelectromechanical component comprising at least one further substrate, the substrate being arranged above the at least one further substrate.
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40. A microelectromechanical component comprising a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side comprising at least one microelectromechanical element and at least one support which is connected to the first side of the substrate, wherein the substrate has at least one electrically conductive passage, connecting the first side to the second side and wherein the substrate is thinned, the mechanical stability of the thinned substrate being ensured by means of the support, whereby said conductive passage is introduced into the thinned substrate, wherein the support is adhesively bonded to the substrate by an epoxy resin.
Specification