Support elements for semiconductor devices with peripherally located bond pads

• US 7,285,850 B2
• Filed: 05/08/2006
• Issued: 10/23/2007
• Est. Priority Date: 06/18/2002
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Jeung, Boon Suan, Poo, Chia Yong, Loo, Neo Yong, Kwang, Chua Swee, Waf, Low Siu, Yu, Chan Min
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US11/430,375
• Publication Number:
  US 20060208350A1
• Time in Patent Office: 533 Days
• Field of Search: 257/E23.048, 257/E23.061, 257/E23.07, 257/E25.023, 257/773, 257/774, 257/668, 257/680, 257/685, 257/777, 257/692, 257/698, 257/734, 257/723
• US Class Current: 257/692
• CPC Class Codes: H01L 2225/1064 Electrical connections provided on a side surface of one or more of the containers
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA

Abstract

A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector on a peripheral edge of a semiconductor device that may be carried by the support structure. Optionally, the at least one conductive column may engage a feature of (e.g., a recess in) the peripherally disposed outer connector. The at least one conductive column may facilitate alignment of one or more semiconductor devices with the support substrate alignment of semiconductor devices relative to one another, or electrical connection between multiple semiconductor devices of other components.

Claims

1. A support element for supporting at least one semiconductor device, comprising:

a support substrate including at least one conductive structure thereon; and

at least one conductive column of substantially uniform cross-sectional shape and dimensions protruding from the support substrate and in communication with the at least one conductive structure, the at least one conductive column being configured to contact an outer connector on a peripheral edge of the at least one semiconductor device.

2. The support element of claim 1, wherein the at least one conductive column comprises a wire comprising conductive material.

3. The support element of claim 1, wherein the support substrate comprises at least one of a circuit board, an interposer, leads, and another semiconductor device.

4. The support element of claim 2, wherein the wire comprises at least one of gold, copper, and aluminum.

5. The support element of claim 1, wherein a cross-section of the at least one conductive column, taken transverse to a length thereof, has a semicircular shape.

6. The support element of claim 1, wherein a cross-section of the at least one conductive column, taken transverse to a length thereof, has a circular shape.

7. The support structure of claim 1, wherein the outer connector of the at least one semiconductor device includes a recess extending substantially along a length thereof.

8. The support element of claim 7, wherein the diameter of the at least one conductive column is substantially equal to the width of the recess on the outer connector on a peripheral edge of the at least one semiconductor device.

9. The support element of claim 7, wherein the diameter of the at least one conductive column is substantially smaller than the width of the recess on the outer connector on a peripheral edge of the at least one semiconductor device.

10. The support element of claim 1, wherein an end of the at least one conductive column is at least partially supported within an aperture formed in the support substrate, at least a portion of the at least one conductive structure being located adjacent to the aperture.

11. The support element of claim 10, wherein the at least one conductive column is secured to the at least one conductive structure.

12. The support element of claim 11, wherein at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor filled elastomer secures the at least one conductive column to the at least one conductive structure.

13. The support element of claim 11, wherein at least a portion of the end of the at least one conductive column contacts a portion of the at least one conductive structure.

14. The support structure of claim 11, wherein a quantity of conductive material contacts both the at least one conductive column and the at least one conductive structure.

15. The support structure of claim 14, wherein the quantity of conductive material comprises at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor filled elastomer.

16. The support structure of claim 1, wherein the at least one conductive column and the outer connector are secured in electrical communication with one another.

17. The support structure of claim 16, wherein a quantity of conductive material secures the at least one conductive column and the outer connector in electrical communication with one another.

18. The support structure of claim 17, wherein the conductive material comprises at least one of solder, another metal or metal alloy, a conductive elastomer, and a conductor filled elastomer.

19. The support structure of claim 1, comprising a plurality of semiconductor devices in stacked arrangement.

20. The support structure of claim 19, wherein adjacent active surfaces and back sides of adjacently positioned semiconductor devices of the plurality of semiconductor devices are substantially electrically isolated from one another.

21. The support structure of claim 19, wherein corresponding outer connectors or at least some of the plurality of semiconductor devices are in alignment with one another.

22. The support structure of claim 21, wherein aligned outer connectors of the at least some of the plurality of semiconductor devices include recesses therein.

23. The support structure of claim 22, wherein the recesses are in line with one another and at least partially receive the at least one conductive column.

24. The support structure of claim 19, wherein the at least one conductive column has a height that is substantially equal to a stack height of the plurality of semiconductor devices.

25. The support structure of claim 1, comprising a plurality of conductive columns protruding from the support substrate.

26. The support structure of claim 25, wherein each of the plurality of conductive columns is located so as to be positioned adjacent to a single peripheral edge of the at least one semiconductor device.

27. The support structure of claim 25, where the plurality of conductive columns is located so that columns are positioned adjacent to more than one peripheral edge of the at least one semiconductor device.