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Support elements for semiconductor devices with peripherally located bond pads

  • US 7,285,850 B2
  • Filed: 05/08/2006
  • Issued: 10/23/2007
  • Est. Priority Date: 06/18/2002
  • Status: Expired due to Term
First Claim
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1. A support element for supporting at least one semiconductor device, comprising:

  • a support substrate including at least one conductive structure thereon; and

    at least one conductive column of substantially uniform cross-sectional shape and dimensions protruding from the support substrate and in communication with the at least one conductive structure, the at least one conductive column being configured to contact an outer connector on a peripheral edge of the at least one semiconductor device.

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