Support elements for semiconductor devices with peripherally located bond pads
First Claim
1. A support element for supporting at least one semiconductor device, comprising:
- a support substrate including at least one conductive structure thereon; and
at least one conductive column of substantially uniform cross-sectional shape and dimensions protruding from the support substrate and in communication with the at least one conductive structure, the at least one conductive column being configured to contact an outer connector on a peripheral edge of the at least one semiconductor device.
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Accused Products
Abstract
A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector on a peripheral edge of a semiconductor device that may be carried by the support structure. Optionally, the at least one conductive column may engage a feature of (e.g., a recess in) the peripherally disposed outer connector. The at least one conductive column may facilitate alignment of one or more semiconductor devices with the support substrate alignment of semiconductor devices relative to one another, or electrical connection between multiple semiconductor devices of other components.
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Citations
27 Claims
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1. A support element for supporting at least one semiconductor device, comprising:
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a support substrate including at least one conductive structure thereon; and at least one conductive column of substantially uniform cross-sectional shape and dimensions protruding from the support substrate and in communication with the at least one conductive structure, the at least one conductive column being configured to contact an outer connector on a peripheral edge of the at least one semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification