Packaged device and method of forming same

• US 7,285,855 B2
• Filed: 01/22/2007
• Issued: 10/23/2007
• Est. Priority Date: 10/23/2004
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Foong, Chee Seng
• Primary Examiner(s): Lebentritt, Michael
• Assistant Examiner(s): Roman, Angel
• Application Number:
  US11/625,350
• Publication Number:
  US 20070114664A1
• Time in Patent Office: 274 Days
• Field of Search: 257/707, 257/738, 257/796
• US Class Current: 257/738
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/43848 Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/4569 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18165 : of a wire bonded chip
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns

Abstract

A method of packaging an integrated circuit die (12) includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls such that the die is surrounded by the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound. The result is an encapsulated IC having a bottom side with exposed balls.

Claims

1. A packaged integrated circuit die, comprising:

a plurality of conductive balls having top, flattened surfaces;

a first mold compound that holds the plurality of conductive balls together, wherein the top, flattened surfaces are generally coplanar with a top surface of the first mold compound, and bottom, opposing surfaces of the balls are exposed;

an integrated circuit die having a first side attached to a plurality of the conductive balls such that the die is in direct contact with said plurality of the conductive balls, wherein the die is surrounded by others of the conductive balls, and wherein the die is electrically connected to the others of the conductive balls; and

a second mold compound encapsulating at least a second side of the die opposing the die first side, and the top surfaces of the conductive balls.

2. The packaged integrated circuit die of claim 1 wherein the conductive balls comprise solder balls.

3. The packaged integrated circuit die of claim 1, wherein the balls are spaced at a predetermined pitch.

4. The packaged integrated circuit die of claim 1, further comprising a heat sink disposed amongst the plurality of conductive balls, the heat sink having a first surface that is substantially coplanar with a top surface of the first mold compound and wherein the die is attached to the first surface of the heat sink.

5. The packaged integrated circuit die of claim 1, wherein the die is attached to the flattened, top surfaces of a plurality of the conductive balls.

6. The packaged integrated circuit die of claim 1, wherein die bonding pads of the integrated circuit die are electrically connected to respective ones of the conductive balls surrounding the die with a corresponding plurality of wires.

7. The packaged integrated circuit die of claim 6, wherein the wires penetrate into the balls and are embedded therein.

8. The packaged integrated circuit die of claim 7, wherein the balls are formed of a metal that is softer than the wires so that the wires are embedded in the balls.

9. The packaged integrated circuit die of claim 6, wherein the wires are insulated wires.

10. The packaged integrated circuit die of claim 1, wherein a surface of the conductive balls opposing the flattened surface of the balls protrudes beyond a bottom surface of the first mold compound.