Pressure sensor

• US 7,287,433 B2
• Filed: 06/01/2006
• Issued: 10/30/2007
• Est. Priority Date: 06/27/2005
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Tanaka, Hiroaki
• Primary Examiner(s): Allen; Andre J.
• Application Number:
  US11/444,302
• Publication Number:
  US 20060288793A1
• Time in Patent Office: 516 Days
• Field of Search: 737/54, 737/21, 737/27
• US Class Current: 73/727
• CPC Class Codes: G01L 19/0627 Protection against aggressive medium in general
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means

Abstract

A pressure sensor for detecting a pressure and for outputting a signal based on the piezoresistance effect includes a substrate having a sensor chip on one side in a thin portion and a concave portion on another side, a piezo-resistor in the sensor chip, a pedestal being attached to the substrate and having a through hole for introducing the pressure to the sensor chip and a gel material filled in the concave portion and the through hole for protecting the sensor chip. A ratio of a diameter of the through hole to a thickness of the pedestal is substantially within a range between 1 and 3.

Claims

1. A pressure sensor for detecting a pressure and for outputting a signal based on the piezoresistance effect of a sensor chip comprising:

a substrate having the sensor chip on one side and a concave portion on another side, wherein an area of sensor ship disposition on the one side of the substrate corresponds to an area of the concave portion on the another side of the substrate to form a thin portion;

a piezo-resistor in the sensor chip for outputting a sensor signal that proportionally represents an applied pressure;

a pedestal being attached to the substrate and having a through hole for introducing the pressure to the sensor chip on the thin portion; and

a gel material filled in the concave portion and the through hole for protecting the sensor chip,

wherein the pedestal made of glass is attached to the substrate by anodic bonding, and

a ratio of a diameter of the through hole to a thickness of the pedestal is substantially within a range of 1 to 3.

2. The pressure sensor as in claim 1,

wherein a diameter of an opening of the through hole on a sensor chip side is smaller than a diameter of the concave portion.

3. The pressure sensor as in claim 1 further comprising:

a case disposed on the pedestal having a window for introducing the pressure to the through hole,

wherein the case is attached to an opposite side of the pedestal relative to the sensor chip,

a mass of the gel material fills the window and the through hole as an integrated body, and

a case side diameter of the through hole is smaller than a pedestal side diameter of the window.

4. The pressure sensor as in claim 3,

wherein the window in a hole shape has a greater diameter on a pressure sensing side than on a pedestal side.

5. The pressure sensor as in claim 4,

wherein an internal circumference of the window is entirely covered by a covering fixed thereon, and

the mass of the gel material completely fills up a space in the window with the covering on the internal circumference of the window sealed by the mass of the gel material.

6. A pressure sensor for detecting a pressure and for outputting a signal based on the piezoresistance effect of a sensor chip comprising:

a substrate having the sensor chip on one side and a concave portion on another side, wherein an area of sensor ship disposition on the one side of the substrate corresponds to an area of the concave portion on the another side of the substrate to form a thin portion;

a piezo-resistor in the sensor chip for outputting a sensor signal that proportionally represents an applied pressure;

a pedestal being attached to the substrate and having a through hole for introducing the pressure to the sensor chip on the thin portion; and

a gel material filled in the concave portion and the through hole for protecting the sensor chip,

wherein the pedestal is made of ceramic attached to the substrate by covalent bonding, and

a ratio of a diameter of the through hole to a thickness of the pedestal is substantially within a range of 1 to 3.

7. The pressure sensor as in claim 6,

wherein a diameter of an opening of the through hole on a sensor chip side is smaller than a diameter of the concave portion.

8. The pressure sensor as in claim 6 further comprising:

a case disposed on the pedestal having a window for introducing the pressure to the through hole,

wherein the case is attached to an opposite side of the pedestal relative to the sensor chip,

a mass of the gel material fills the window and the through hole as an integrated body, and

a case side diameter of the through hole is smaller than a pedestal side diameter of the window.

9. The pressure sensor as in claim 8,

wherein the window in a hole shape has a greater diameter on a pressure sensing side than on a pedestal side.

10. The pressure sensor as in claim 9,

wherein an internal circumference of the window is entirely covered by a covering fixed thereon, and

the mass of the gel material completely fills up a space in the window with the covering on the internal circumference of the window sealed by the mass of the gel material.