Electronic devices with small functional elements supported on a carrier

• US 7,288,432 B2
• Filed: 10/14/2004
• Issued: 10/30/2007
• Est. Priority Date: 03/16/1999
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Jacobsen, Jeffrey Jay, Gengel, Glenn Wilhelm, Hadley, Mark A., Craig, Gordon S. W., Smith, John Stephen
• Primary Examiner(s): WILCZEWSKI, MARY A
• Application Number:
  US10/966,617
• Publication Number:
  US 20050046018A1
• Time in Patent Office: 1,111 Days
• Field of Search: 438/117, 438/125, 438/107
• US Class Current: 438/107
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01084 : Polonium [Po]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/24926 : including ceramic, glass, porcelain or quartz layer
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Claims

1. A method of fabricating an electronic assembly, said method comprising:

providing a substrate with a plurality of blocks each of which includes at least one functional component;

applying an electrical interconnect layer onto a flexible layer;

attaching said flexible layer to said substrate;

electrically coupling said electrical interconnect layer to at least one of said blocks; and

electrically coupling a flexible antenna to at least one of said plurality of blocks, said flexible antenna being formed on a second substrate.

2. The method of claim 1, wherein said at least one functional component is an electrical component and wherein said blocks are fabricated separately from said substrate and are deposited onto said substrate.

3. The method of claim 1, wherein said substrate is flexible and said blocks are deposited onto recessed regions of said substrate.

4. The method of claim 3, wherein said substrate is attached to said flexible layer in a web process apparatus.

5. The method of claim 3, wherein the blocks are robotically placed into empty recessed regions.

6. The method of claim 1, wherein the flexible layer is selected from the group consisting of polyether sulfone, polyethylene terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, polypropylene, polyester, aramid, polyamide-imide, polyimide, aromatic polyimides, polyetherimide, metallic materials, acrylonitrile butadiene styrene, polyvinyl chloride, polyamide, nylon, polybutylene naphthalate, polyethylene naphthalate, polybutylene naphthalate, and polycycloolefins.

7. The method of claim 1, wherein a slurry containing said plurality of blocks is deposited onto the flexible layer.

8. The method of claim 1, wherein the blocks are transferred to said substrate by pressing a template having said blocks into the substrate.

9. The method of claim 1, further comprising applying interconnect onto the web material by laser.

10. The method of claim 1, further comprising applying interconnect onto the flexible layer by photolithography.

11. The method of claim 1, further comprising applying interconnect onto the flexible layer by screen printing.

12. The method of claim 1, further comprising applying interconnect onto the flexible layer by ink jet processes.

13. The method of claim 1, further comprising applying interconnect onto the flexible layer by ultraviolet light.

14. The method of claim 1, further comprising transferring a plurality of blocks to a flexible layer by a template.

15. The method of claim 1, wherein the electrical interconnect layer is selected from the group consisting of aluminum, copper, silver, and gold.

16. The method of claim 1, wherein the flexible antenna is coupled to at least one of said plurality of blocks through an alignment operation.

17. The method of claim 16, wherein the alignment operation occurs when said second substrate is coupled to said flexible layer.

18. The method of claim 1, wherein said substrate carrying a plurality of blocks and said second substrate carrying said flexible antenna are coupled in a web process apparatus.

19. The method of claim 18, wherein said substrate, said flexible layer, and said second substrate are made of a web material.

20. The method of claim 1, further comprising transmitting a signal between said substrate with said plurality of blocks and said second substrate having said flexible antenna.

21. The method of claim 20, wherein said signal is transmitted through at least one via.

22. The method of claim 1, further comprising forming at least one via through said flexible layer.

23. The method of claim 22, further comprising forming a conductive material in said at least one via wherein the conductive material connects at least one of said plurality of blocks to said electrical interconnect.

24. The method of claim 23, wherein the conductive material is an aluminum alloy.

25. The method of claim 22, wherein said at least one via is connected to one of said plurality of blocks.

26. The method of claim 1, wherein said attaching occurs before said applying.

27. A method of fabricating an electronic assembly, said method comprising:

providing a flexible layer with a plurality of blocks each of which includes at least one functional component;

applying an electrical interconnect layer onto the flexible layer;

attaching said flexible layer to a substrate;

electrically coupling said electrical interconnect layer to at least one of said blocks; and

electrically coupling a flexible antenna to at least one of said plurality of blocks, said flexible antenna being formed on a second substrate.

28. The method of claim 27, wherein the flexible layer includes the material selected from the group consisting of aluminum, copper, silver, gold, metal, polyether sulfone, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, polypropylene, polyester, aramid, polyamide-imide, polyimide, aromatic polyimides, polyetherimide, acrylonitrile butadiene styrene, polyvinyl chloride, polyamide, nylon, polybutylene naphthalate (PBN), polyethylene naphthate, polybutylene naphthalate, and polycycloolefins.

29. The method of claim 27, wherein the flexible layer is reflective.

30. The method of claim 27, wherein the flexible antenna is coupled to at least one of said plurality of blocks through an alignment operation.

31. The method of claim 30, wherein the alignment operation occurs when said second substrate is coupled to said flexible layer.

32. The method of claim 27, wherein said flexible layer with a plurality of blocks and said second substrate carrying said flexible antenna are coupled in a web process apparatus.

33. The method of claim 32, wherein said substrate, said flexible layer, and said second substrate are made of a web material.

34. The method of claim 27, further comprising transmitting a signal between said flexible layer with said plurality of blocks and said second substrate having said flexible antenna.

35. The method of claim 34, wherein said signal is transmitted through at least one via.

36. The method of claim 27, further comprising forming at least one via through said substrate layer.

37. The method of claim 36, further comprising forming a conductive material in said at least one via wherein the conductive material connects at least one of said plurality of blocks to said electrical interconnect.

38. The method of claim 37, wherein the conductive material is an aluminum alloy.

39. The method of claim 36, wherein said at least one via is connected to one of said plurality of blocks.