Apparatus and methods for cooling semiconductor integrated circuit package structures
First Claim
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1. A semiconductor package, comprising:
- a semiconductor chip having a plurality of first thermal fins on a non-active surface of the semiconductor chip, wherein the first thermal fins longitudinally extend across the non-active surface of the semiconductor;
a heat conducting device having a plurality of second thermal fins on a mating surface of the heat conducting device, wherein the second thermal fins longitudinally extend across the mating surface of the heat conducting device; and
a thermal joint formed between the non-active surface of the semiconductor chip and the mating surface of the heat conducting device, the thermal joint comprising a plurality of interdigitated thermal fins separated by a compliant thermally conductive material, wherein the interdigitated thermal fins comprise the first and second thermal fins, and wherein a gap size between the interdigitated thermal fins of the thermal joint varies across the thermal joint.
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Abstract
Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.
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Citations
25 Claims
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1. A semiconductor package, comprising:
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a semiconductor chip having a plurality of first thermal fins on a non-active surface of the semiconductor chip, wherein the first thermal fins longitudinally extend across the non-active surface of the semiconductor; a heat conducting device having a plurality of second thermal fins on a mating surface of the heat conducting device, wherein the second thermal fins longitudinally extend across the mating surface of the heat conducting device; and a thermal joint formed between the non-active surface of the semiconductor chip and the mating surface of the heat conducting device, the thermal joint comprising a plurality of interdigitated thermal fins separated by a compliant thermally conductive material, wherein the interdigitated thermal fins comprise the first and second thermal fins, and wherein a gap size between the interdigitated thermal fins of the thermal joint varies across the thermal joint. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A MCM (multiple chip module) package, comprising:
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a package substrate; a plurality of semiconductor chips mounted face down on the package substrate; and a heat conducting device that is thermally coupled to each semiconductor chip using an associated thermal joint connection disposed between a nonactive surface of the semiconductor chip and the heat conducting device, wherein each thermal joint connection comprises a hand of thermal fins formed by a plurality of longitudinally extending parallel interdigitated thermal fins separated by a compliant thermally conductive material, and wherein each thermal joint connection is disposed such that each corresponding band of thermal fins is orientated to extend in a direction towards a common point of the package substrate, the common point corresponding to a neutral stress point of the semiconductor package, and such that the corresponding band of thermal fins for two or more thermal joint connections are orientated to extend in non-parallel directions towards said common point. - View Dependent Claims (23, 24, 25)
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Specification