Characterization and compensation of errors in multi-axis interferometry systems

• US 7,289,226 B2
• Filed: 11/04/2004
• Issued: 10/30/2007
• Est. Priority Date: 11/04/2003
• Status: Expired due to Fees

• Current Assignee: Zygo Corporation (Ametek Incorporated)
• Original Assignee: Zygo Corporation (Ametek Incorporated)
• Inventors: Hill, Henry A.
• Primary Examiner(s): CONNOLLY, PATRICK J
• Application Number:
  US10/981,316
• Publication Number:
  US 20050134862A1
• Time in Patent Office: 1,090 Days
• Field of Search: 356399-401, 356/486, 356/493, 356/498, 356/500, 356508-510
• US Class Current: 356/500
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric

Abstract

In general, in one aspect, the invention features a method that includes monitoring a position of a stage along a first measurement axis and a second measurement axis of a multi-axis interferometry system and determining a position of the stage with respect to another degree of freedom based on the monitored positions along the first and second axes and predetermined information about how the measurement axes deviate from being parallel to one another.

Claims

1. A method, comprising:

monitoring a position of a stage along a first measurement axis and a second measurement axis of a multi-axis interferometry system;

determining a position of the stage with respect to another degree of freedom based on the monitored positions along the first and second axes and predetermined information about how the measurement axes deviate from being parallel to one another; and

outputting a signal based on the determined position.

2. The method of claim 1, wherein the degree of freedom of the stage is an orientation angle of the stage.

3. The method of claim 1, wherein the degree of freedom of the stage is the position of the stage along a third axis parallel to but separate from the first and second measurement axes of the multi-axis interferometry system.

4. The method of claim 3, wherein the degree of freedom of the stage corresponds to the position of an artifact with respect to the third axis.

5. The method of claim 4, wherein the artifact is an alignment mark on a wafer supported by the stage.

6. The method of claim 4, wherein the artifact is an alignment mark on the stage.

7. The method of claim 3, wherein the third axis corresponds to the position of an alignment scope positioned to locate an alignment mark on the stage.

8. The method of claim 1, wherein the predetermined information comprises information about a variation in a distance between the measurement axes.

9. The method of claim 8, wherein the predetermined information comprises information about an initial distance, d1, between the axes.

10. The method of claim 9, wherein the information about a variation in a distance between the measurement axes comprises a relationship between the distance between the measurement axes and displacement of the stage along one of the measurement axes.

11. The method of claim 9, wherein the information about a variation in a distance between the measurement axes comprises a value corresponding to the rate of change of the distance between the measurement axes with respect to a position of the stage along one of the measurement axes.

12. The method of claim 1, wherein the multi-axis interferometry system produces an output beam comprising a phase related to an optical path difference between a path of a first beam and a path of a second beam, wherein the first beam contacts a measurement object associated with the stage at a first location and the first or second beam contacts the measurement object at a second location different from the first location, wherein the predetermined information accounts for contributions to the optical path difference caused by a deviation of the path of the first or second beam from a nominal beam path due to an imperfection of the measurement object at the first location and due to an imperfection of the measurement object at the second location.

13. The method of claim 12, wherein the predetermined information accounts for contributions to the optical path difference caused by a deviation of the path of the first or second beam within a plane defined by the nominal beam path due to the imperfection of the measurement object at the first or second location.

14. The method of claim 12, wherein the predetermined information accounts for contributions to the optical path difference caused by a deviation of the path of the first or second beam out of a plane defined by a nominal beam path due to the imperfection of the measurement object at the first or second location.

15. The method of claim 14, wherein the predetermined information further accounts for contributions to the optical path difference caused by a deviation of the path of the first or second beam from the nominal beam path due to an imperfection in at least one optic of the interferometry system.

16. The method of claim 15, wherein the imperfection in at least one optic of the interferometer comprises an imperfection in a surface of the optic.

17. The method of claim 15, wherein the imperfection in at least one optic of the interferometer comprises a bulk imperfection in the optic.

18. The method of claim 12, wherein the predetermined information further accounts for contributions to the optical path difference caused by a deviation of the path of the first or second beam from the nominal beam path due to an imperfection in a light source that causes an input beam derived from the light source to deviate from an input beam path to the interferometer.

19. The method of claim 1, wherein the predetermined information is stored as a representation in an electronic storage medium.

20. The method of claim 19, wherein the representation comprises a lookup table.

21. The method of claim 19, wherein the representation comprises a functional representation.

22. The method of claim 1, wherein the multi-axis interferometry system comprises a single axis interferometers.

23. The method of claim 1, wherein the multi-axis interferometry system comprises a multi-axis interferometer.

24. A lithography method for use in fabricating integrated circuits on a wafer, the method comprising:

supporting the wafer on a moveable stage;

imaging spatially patterned radiation onto the wafer;

adjusting the position of the stage; and

monitoring the position of the stage using the method of claim 1.

25. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 24; and

producing an integrated circuit from the wafer.

26. A lithography method for use in the fabrication of integrated circuits comprising:

directing input radiation through a mask to produce spatially patterned radiation;

positioning the mask relative to the input radiation;

monitoring the position of the mask relative to the input radiation using the method of claim 1; and

imaging the spatially patterned radiation onto a wafer.

27. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 26; and

producing an integrated circuit from the wafer.

28. A lithography method for fabricating integrated circuits on a wafer comprising:

positioning a first component of a lithography system relative to a second component of a lithography system to expose the wafer to spatially patterned radiation; and

monitoring the position of the first component relative to the second component using the method of claim 1.

29. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 28; and

producing an integrated circuit from the wafer.

30. A method for fabricating a lithography mask, the method comprising:

directing a write beam to a substrate to pattern the substrate;

positioning the substrate relative to the write beam; and

monitoring the position of the substrate relative to the write beam using the method of claim 1.

31. A system, comprising:

a multi-axis interferometry system configured to monitor a position of a stage along a first measurement axis and a second measurement axis; and

an electronic controller configured to determine a position of the stage with respect to another degree of freedom based on the monitored positions along the first and second axes and predetermined information about how the measurement axes deviate from being parallel to one another.

32. The system of claim 31, wherein the multi-axis interferometry system comprises one or more single axis interferometers.

33. The system of claim 31, wherein the multi-axis interferometry system comprises a multi-axis interferometer.

34. The system of claim 31, wherein the multi-axis interferometry system is further configured to monitor a position of the stage along a third measurement axis perpendicular to the first measurement axis.

35. The system of claim 31, wherein the stage is configured to support a wafer.

36. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer;

an illumination system for imaging spatially patterned radiation onto the wafer;

a positioning system for adjusting the position of the stage relative to the imaged radiation; and

the multi-axis interferometry system of claim 31 for monitoring the position of the wafer relative to the imaged radiation.

37. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 36; and

producing an integrated circuit from the wafer.

38. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer; and

an illumination system including a radiation source, a mask, a positioning system, a lens assembly, and the multi-axis interferometry system of claim 31,

wherein during operation the source directs radiation through the mask to produce spatially patterned radiation, the positioning system adjusts the position of the mask relative to the radiation from the source, the lens assembly images the spatially patterned radiation onto the wafer, and the multi-axis interferometry system monitors the position of the mask relative to the radiation from the source.

39. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 38; and

producing an integrated circuit from the wafer.

40. A beam writing system for use in fabricating a lithography mask, the system comprising:

a source providing a write beam to pattern a substrate;

a stage supporting the substrate;

a beam directing assembly for delivering the write beam to the substrate;

a positioning system for positioning the stage and beam directing assembly relative one another; and

the multi-axis interferometry system of claim 31 for monitoring the position of the stage relative to the beam directing assembly.

41. A method for determining a position of a stage with respect to at least one degree of freedom, the method comprising:

monitoring a location, x₁, of the stage along a first measurement axis of a multi-axis interferometry system that produces an output beam comprising a phase related to an optical path difference between a path of a first beam and a path of a second beam, wherein the first beam contacts a measurement object associated with the stage at a first location and the first or second beam contacts the measurement object at a second location different from the first location;

monitoring a location, x₂, of the stage along a second measurement axis of the multi-axis interferometry system; and

determining the position of the stage with respect to the degree of freedom based on x₁, x₂, and a correction term ψ

₃,

wherein ψ

₃ accounts for contributions to the optical path difference caused by a deviation of the path of the first or second beam from a nominal beam path due to an imperfection of the measurement object at the first location and due to an imperfection of the measurement object at the second location; and

outputting a signal based on the determined position.

42. The method of claim 41, wherein ψ

₃ comprises predetermined information about how the measurement axes deviate from being parallel to one another.