Composite MEMS pressure sensor configuration
First Claim
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1. A dual die pressure sensor, comprising:
- (a) a first die of a semiconductor material etched in the form of a diaphragm with a center boss;
(b) a second die of a semiconductor material etched in the form of a structure comprising a center boss supported by at least two beams; and
(c) at least one strain gauge placed on each beam;
(d) wherein said first and second dies are joined causing the boss of the first die to be linked to the boss of the second die.
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Abstract
A pressure sensor assembly comprised of a single and dual layer diaphragm with integrated force sensing flexure, such as a cantilever beam. Strain gages are positioned on the force sensing beam. The pressure forces the diaphragm to deflect. The deflection is constrained by the beam, which is compelled to bend. The bending induces strains in strain gages located on the beam. The strain gages are connected in a Wheatstone bridge configuration. When a voltage is applied to the bridge, the strain gages provide an electrical output signal proportional to the pressure. Composite diaphragm—beam pressure sensors convert pressure more efficiently and improve sensor performance.
37 Citations
18 Claims
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1. A dual die pressure sensor, comprising:
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(a) a first die of a semiconductor material etched in the form of a diaphragm with a center boss; (b) a second die of a semiconductor material etched in the form of a structure comprising a center boss supported by at least two beams; and (c) at least one strain gauge placed on each beam; (d) wherein said first and second dies are joined causing the boss of the first die to be linked to the boss of the second die. - View Dependent Claims (2, 3)
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4. A dual die pressure sensor, comprising:
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(a) a first die of a semiconductor material etched in the form of a flat diaphragm with a center protrusion formed by thinning regions of the surface of the diaphragm; (b) a second die of a semiconductor material etched in the form of a structure comprising a center boss supported by at least two beams; (c) at least one strain gauge placed on each beam; (d) wherein said first and second dies are joined causing the center protrusion of the first die to be linked to the boss of the second die. - View Dependent Claims (5, 6)
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7. A method for manufacturing a pressure sensor, comprising the steps of:
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(a) etching a die of a semiconductor material in the form of a flat diaphragm of first thickness; (b) forming a beam with the predetermined first thickness by thinning down regions of the diaphragm exterior surface to a smaller second predetermined thickness; and (c) placing a plurality of strain gauges on said beam. - View Dependent Claims (8, 9, 10, 11)
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12. A pressure sensor, comprising:
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(a) a first die of a semiconductor material comprising a flat diaphragm having a center protrusion, formed by thinning down regions of the exterior surface of said diaphragm; (b) a Pyrex glass base bonded to said first die; (c) a second die of a semiconductor material etched in the form of a beam array having a plurality of beams; and (d) at least one strain gauge placed on each beam; (e) wherein said second die overlaps said first die and is bonded to said Pyrex glass base. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification