Chemical vapor deposition plasma process using plural ion shower grids

• US 7,291,360 B2
• Filed: 06/22/2004
• Issued: 11/06/2007
• Est. Priority Date: 03/26/2004
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Tanaka, Tsutomu, Ramaswamy, Kartik, Hanawa, Hiroji, Collins, Kenneth S., Nguyen, Andrew, Al-Bayati, Amir
• Primary Examiner(s): Meeks; Timothy
• Assistant Examiner(s): GAMBETTA, KELLY M
• Application Number:
  US10/873,600
• Publication Number:
  US 20050214478A1
• Time in Patent Office: 1,232 Days
• Field of Search: 427/248.1, 427/569, 118/719
• US Class Current: 427/248.1
• CPC Class Codes: C23C 16/402 Silicon dioxide
• CPC Class Codes: C23C 16/452 by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
• CPC Class Codes: C23C 16/517 using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515

Abstract

A chemical vapor deposition process is carried out in a reactor chamber having a set of plural parallel ion shower grids that divide the chamber into an upper ion generation region and a lower process region, each of the ion shower grids having plural orifices in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective ion shower grid. A workpiece is placed in the process region, so that a workpiece surface of the workpiece is generally facing a surface plane of the nearest one of the ion shower grids, and a gas mixture comprising a deposition precursor species is furnished into the ion generation region. The process region is evacuated at an evacuation rate sufficient to create a pressure drop across the plural ion shower grids between the ion generation and process regions whereby the pressure in the ion generation region is several times the pressure in the process region. The process further includes applying plasma source power to generate a plasma of the deposition precursor species in the ion generation region and applying successive grid potentials to successive ones of the grids.

Claims

1. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids;

wherein said successive grid potentials comprise time-varying voltages; and

limiting an angular trajectory distribution of ions in said process region by a desired amount by;

(a) providing said orifices with a corresponding length-to-diameter aspect ratio, and (b) maintaining said pressure drop at a sufficient level to establish an ion-neutral mean collision distance in excess of a gap between said set of ion shower grids and said workpiece.

2. The process of claim 1 further comprising performing charge neutralization by applying at least some of said grid potentials as RF voltages.

3. The process of claim 1 further comprising transforming said flux of ions at a bottom one of said grids to a flux of neutrals that is incident on said workpiece, whereby said bottom one of said grids comprises a neutralization grid.

4. The process of claim 1 wherein said pressure drop is sufficient to keep an ion-neutral mean collision distance in said process region in excess of a distance between said workpiece and said set of ion shower grids.

5. The process of claim 1 wherein the step of applying successive grid potentials to said successive ones of said grids comprises applying attractive grid potentials to alternate ones of said grids and applying small repulsive potentials to remaining ones of said grids to focus ions toward centers of said orifices.

6. The process of claim 1 wherein the step of applying successive potentials to successive ones of said grids comprises applying successively greater potentials that are attractive to ions to successive ones of said grids with the grid closest to said ion generation region having the least attractive potential and the grid closest to said workpiece having the greatest attractive potential.

7. The process of claim 1 further comprising controlling the potential of the plasma in said ion generation region by controlling the potential of the uppermost one of said grids.

8. The process of claim 1 wherein the step of applying plasma source power comprises capacitively coupling plasma source power into said ion generation region.

9. The process of claim 8 wherein the step of capacitively coupling plasma source power comprises applying RF power from an RF generator between a ceiling of said reactor and one of (a) the uppermost one of said grids, (b) a side wall of said ion generation region of said reactor.

10. The process of claim 8 further comprising applying a bias potential to said workpiece.

11. The process of claim 10 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

12. The process of claim 10, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

13. The process of claim 8 wherein said plasma source power comprises RF power and each of said grid potentials comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

14. The process of claim 13 wherein each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

15. The process of claim 13 further comprising maintaining said workpiece and the grid nearest said workpiece at generally the same electrical potential.

16. The process of claim 1 wherein the step of applying plasma source power comprises inductively coupling plasma source power into said ion generation region.

17. The process of claim 16 further comprising applying a bias potential to said workpiece.

18. The process of claim 17, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

19. The process of claim 16 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

20. The process of claim 16 wherein said plasma source power comprises RF power and said grid potentials comprise at least one of:

(a) pulsed D.C. voltages, (b) RF voltages, (c) D.C. voltages, (d) a pulsed RF voltage.

21. The process of claim 20 wherein each of said grid potentials comprises a mixture of at least two of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

22. The process of claim 20 further comprising maintaining said workpiece and the grid nearest said workpiece at generally the same electrical potential.

23. The process of claim 1 wherein the step of applying plasma source power comprises coupling microwave plasma source power into said ion generation region.

24. The process of claim 23 further comprising applying a bias potential to said workpiece.

25. The process of claim 24 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

26. The process of claim 24, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

27. The process of claim 23 wherein said grid potentials comprise at least one of:

(a) pulsed D.C. voltages, (b) RF voltages, (c) D.C. voltages, (d) pulsed RF voltages.

28. The process of claim 27 further comprising maintaining said workpiece and the grid nearest said workpiece at generally the same electrical potential.

29. The process of claim 23 wherein said each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

30. The process of claim 1 wherein said deposition precursor species comprise silicon and oxygen and said process deposits silicon dioxide.

31. The process of claim 30 wherein said deposition precursor further comprises at least one of the following additive species:

hydrogen, fluorine, phosphorus, boron, carbon.

32. The process of claim 1 wherein said deposition precursor species comprise silicon and nitrogen and said process deposits silicon nitride.

33. The process of claim 32 wherein said deposition precursor further comprises at least one of the following additive species:

hydrogen, fluorine, phosphorus, boron, carbon.

34. The process of claim 1 further comprising maintaining said workpiece and the grid nearest said workpiece at generally the same electrical potential.

35. The process of claim 1 further comprising thermally coupling said workpiece to a workpiece support pedestal and thermally cooling or heating said workpiece support pedestal.

36. The process of claim 35 further comprising electrostatically chucking said workpiece on said workpiece support pedestal.

37. The process of claim 1 further comprising a bias potential to said workpiece.

38. The process of claim 37 further comprising maintaining said plasma at a reference potential and wherein the steps of applying said grid voltages and said bias voltage comprises applying ion-attractive voltages of successively greater magnitude to successive ones of said grids and applying the greatest ion-attractive voltage to said workpiece.

39. The process of claim 38 wherein said reference potential is at least nearly equal to RF ground and said ion-attractive voltages are negative voltages.

40. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a nonparallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids; and

controlling the temperature of said ion shower grid by pumping a thermal control fluid through fluid flow passages thermally coupled to said ion shower grid and controlling the temperature of said thermal control fluid.

41. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids; and

providing neutralization electrons in the vicinity of said workpiece by providing a plasma from an external plasma source into said process region.

42. The process of claim 41 wherein the step of providing neutralization electrons comprises establishing a magnetic field near said workpiece having sufficient magnetic flux to trap electrons near said workpiece surface.

43. The process of claim 41 wherein the step of providing neutralization electrons comprises generating a flow of electrons from an electron gun toward said workpiece surface.

44. The process of claim 41 wherein the step of providing neutralization electrons comprises injecting an electron-donor gas into said process region and near said workpiece.

45. The process of claim 44 wherein said electron-donor gas comprises Xenon.

46. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids; and

wherein said applying plasma source power comprises generating a toroidal plasma current in said ion generation region through an external reentrant conduit coupled across said ion generation region and coupling the RF plasma source power into the external reentrant conduit.

47. The process of claim 46 further comprising applying a bias potential to said workpiece.

48. The process of claim 47 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

49. The process of claim 47, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

50. The process of claim 46 wherein said plasma source power comprises RF power and said grid potentials comprise at least one of:

(a) pulsed D.C. voltages, (b) RF voltages, (c) D.C. voltages, (d) pulsed RF voltages.

51. The process of claim 50 wherein each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

52. The process of claim 50 further comprising maintaining said workpiece and the grid nearest said workpiece at generally the same electrical potential.

53. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a nonparallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids;

prior to the step of placing a workpiece in said process region, depositing a layer of a process-compatible material on reactor chamber interior surfaces; and

wherein said depositing a layer of a process-compatible material comprises furnishing into at least one of said ion generation and process regions ions or radicals of said process-compatible material from a plasma source external of said chamber.

54. The process of claim 53 wherein the step of depositing a layer of a process-compatible material comprises:

introducing a process gas comprising a precursor of said process-compatible material into said ion generation region;

applying plasma source power into said ion generation region.

55. The process of claim 54 further comprising applying an ion extraction potential to said grid.

56. The process of claim 53 further comprising the following steps carried out after the step of depositing a layer of a process-compatible material:

removing said workpiece from said chamber;

cleaning the reactor chamber interior surfaces.

57. The process of claim 56 wherein the step of cleaning the reactor interior chamber surfaces comprises:

introducing a process gas comprising an etchant species into said ion generation region;

applying plasma source power into said ion generation region.

58. The process of claim 57 further comprising applying an ion extraction potential to at least one of said grids.

59. The process of claim 56 wherein the step of cleaning the reactor interior surfaces comprises:

furnishing into at least one of said ion generation and process regions ions or radicals of an etchant species.

60. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a nonparallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids; and

traversing said workpiece and said grids relative to one another so as to scan an ion beam from said grids across said workpiece.

61. The process of claim 60 wherein said workpiece has a diameter exceeding that of said grids.

62. A chemical vapor deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids stacked together that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices comprising cylindrical holes in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective ion shower grid;

placing a workpiece in said process region, so that a workpiece surface of said workpiece is generally facing a surface plane of the nearest one of said ion shower grids;

furnishing a gas mixture comprising a deposition precursor species into said ion generation region;

maintaining a pressure drop across said plural ion shower grids whereby the pressure in said ion generation region is several times the pressure in said process region;

applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region;

applying successive grid potentials to successive ones of said grids; and

tilting said workpiece relative to said grids.