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Multi-layer film stack for extinction of substrate reflections during patterning

  • US 7,291,552 B2
  • Filed: 12/13/2005
  • Issued: 11/06/2007
  • Est. Priority Date: 12/27/2000
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • introducing an etch stop layer over a substrate;

    introducing a dielectric layer over the etch stop layer between an interconnection line and a contact point on the substrate, the dielectric layer comprising a plurality of at least three alternating material layers, each alternating layer comprising a first material layer and a different second material layer; and

    patterning an interconnection to the substrate, whereinthe plurality of at least three alternating material layers comprising the dielectric layer collectively having a property that suppresses substrate reflections during patterning.

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