Substrate proximity processing housing and insert for generating a fluid meniscus

• US 7,293,571 B2
• Filed: 04/01/2004
• Issued: 11/13/2007
• Est. Priority Date: 09/30/2002
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Woods, Carl, Smith, Michael G. R., Parks, John
• Primary Examiner(s): Perrin; Joseph L.
• Application Number:
  US10/817,355
• Publication Number:
  US 20050148197A1
• Time in Patent Office: 1,321 Days
• Field of Search: 134/95.1, 134/95.2, 134/99.1, 134/102.3, 134/167.R, 134/198, 134/902
• US Class Current: 134/95.2
• CPC Class Codes: B08B 3/02 Cleaning by the force of jets or sprays
• CPC Class Codes: C25D 17/00 Constructional parts, or assemblies thereof, of cells for electrolytic coating
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 21/00 Processes for servicing or operating cells for electrolytic coating
• CPC Class Codes: C25D 5/08 Electroplating with moving electrolyte e.g. jet electroplating using locally applied jets of electrolyte C25D5/026
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/67023 for general liquid treatment, e.g. etching followed by cleaning
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: H01L 21/6704 for wet cleaning or washing
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67063 for etching
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receiving region that is surrounded by the housing surface. The apparatus also includes a process configuration insert which has an insert surface where the process configuration insert is defined to fit within the process configuration receiving region of the housing such that the insert surface and the housing surface define a proximity face that can be placed proximate to the substrate surface of the substrate.

Claims

1. An apparatus for generating a fluid meniscus to be formed on a substrate, comprising:

a housing having walls and a housing surface with flat regions to be positioned proximate to a surface of the substrate, the housing including a process configuration receiving region that is surrounded by the walls of the housing and the housing surface; and

a process configuration insert having an insert surface, the process configuration insert being defined to fit within the process configuration receiving region between the walls of the housing such that the insert surface and the housing surface define a proximity face having flat surface regions, the proximity face having a plurality of discrete conduits that extend through the housing and the process configuration insert, wherein the proximity face can be positioned proximate to the surface of the substrate.

2. An apparatus for generating a fluid meniscus as recited in claim 1, further comprising:

a cover being configured to be attachable to the walls of the housing to at least partially enclose the process configuration insert within the housing.

3. An apparatus for generating a fluid meniscus as recited in claim 1, wherein the plurality of discrete conduits enable definition of the fluid meniscus.

4. An apparatus for generating a fluid meniscus as recited in claim 3, wherein the plurality of discrete conduits include at least one of a first inlet for applying a first fluid to the substrate surface, a second inlet for applying a second fluid to the substrate surface, and an outlet for removing the first fluid and the second fluid from the substrate surface.

5. An apparatus for generating a fluid meniscus as recited in claim 3, wherein the plurality of discrete conduits include at least one of a first inlet for applying a first fluid to the substrate surface, a second inlet for applying a second fluid to the substrate surface, and an outlet for removing the first fluid and the second fluid from the substrate surface.

6. An apparatus for generating a fluid meniscus as recited in claim 3, wherein the process configuration insert is removable and replaceable with a different process configuration insert with a different plurality discrete conduits with a different configuration than the plurality of discrete conduits of the process configuration insert.

7. An apparatus for generating a fluid meniscus as recited in claim 6, wherein the different plurality of discrete conduits of the different configuration insert is capable of generating a fluid meniscus with a different configuration.

8. An reconfigurable proximity head for generating a fluid meniscus to be formed on a substrate, the reconfigurable proximity head comprising:

a housing body having walls extending between a process side and a cover side, the walls defining an opening at the cover side, and the process side having flat surface regions and further define a receiving region opening, the process side having the flat surface regions including a first set of discrete conduits in a first configuration;

a process configuration insert configured to sit within the housing body and extend through the opening at the cover side and into the receiving region opening, the process configuration insert having an insert surface defined by flat surface regions, the insert surface includes a second set of discrete conduits in a second configuration,

wherein the insert surface of the process configuration insert and the process side of the housing body define a proximity face having the first and second sets of discrete conduits with both the first configuration and the second configuration.

9. The reconfigurable proximity head as recited in claim 8, further comprising:

a cover for attachment to the walls of the housing body to at least partially enclose the process configuration insert within the housing.

10. The reconfigurable proximity head as recited in claim 8, further comprising,

an alternate process configuration insert having a third configuration of discrete conduits, wherein the third configuration is different than the second configuration,

wherein the proximity face includes the first configuration and the third configuration when the alternate process configuration insert replaces another process configuration insert.