Method for fabricating an actuator system

• US 7,294,282 B1
• Filed: 04/01/2005
• Issued: 11/13/2007
• Est. Priority Date: 11/08/2002
• Status: Expired due to Fees

• Current Assignee: Iris Ao, Inc.
• Original Assignee: Iris Ao, Inc.
• Inventors: Helmbrecht, Micheal Albert
• Primary Examiner(s): CULBERT, ROBERTS P
• Application Number:
  US11/096,367
• Time in Patent Office: 956 Days
• Field of Search: 216/2, 216/24, 438/29, 438/52
• US Class Current: 216/24
• CPC Class Codes: G02B 26/06 for controlling the phase of light G02B26/08 takes precedence , measuring optical phase difference G01J9/00
• CPC Class Codes: G02B 26/0825 the reflecting element being a flexible sheet or membrane, e.g. for varying the focus flexible mirrors for cosmetic use A45D42/24

Abstract

An apparatus comprising a substrate; and a platform elevated above the substrate and supported by curved flexures. The curvature of said flexures results substantially from variations in intrinsic residual stress within said flexures. In one embodiment the apparatus is a deformable mirror exhibiting low temperature-dependence, high stroke, high control resolution, large number of degrees of freedom, reduced pin count and small form-factor. Structures and methods of fabrication are disclosed that allow the elevation of mirror segments to remain substantially constant over a wide operating temperature range. Methods are also disclosed for integrating movable mirror segments with control and sense electronics to a produce small-form-factor deformable mirror.

Claims

1. A method for fabricating an actuator system, the method comprising:

forming a microelectromechanical (MEMS) structure comprising a mirror segment and a sacrificial layer;

forming a substrate comprising a control circuit for controlling the MEMS structure and a passivation layer for protecting the substrate;

bonding the MEMS structure with the substrate; and

after bonding the MEMS structure with the substrate, exposing the MEMS structure and the substrate to a release agent to eliminate the sacrificial layer of the MEMS structure, wherein the passivation layer protects the substrate from the release agent.

2. The method of claim 1 further comprising:

after exposing the MEMS structure and the substrate to the release agent, removing the passivation layer of the substrate.

3. The method of claim 2 wherein removing the passivation layer comprises exposing the substrate to a solvent.

16. The method of claim 1 wherein forming the substrate further comprises:

forming, on the substrate, a set of one or more electrodes for inducing actuation of the MEMS structure, wherein the control circuit and the set of electrodes are integrated on the same substrate.

17. The method of claim 16, wherein:

the set of electrodes is formed on a first area on a first layer of the substrate; and

the control circuit is formed in the substrate in areas below the first layer, wherein at least a portion of the control circuit is beneath the first area.

18. The method of claim 16, wherein forming the substrate further comprises:

forming in the substrate, a set of one or more interconnects coupled to the set of electrodes and the control circuit, wherein the set of interconnects are formed completely internal to the substrate.

19. The method of claim 16, wherein:

forming the MEMS structure comprises forming a platform connected with a suspension system; and

forming the substrate further comprises;

forming, in the substrate, a sensing circuit coupled to the set of electrodes for sensing a state of the platform, wherein the sensing circuit, control circuit, and the set of electrodes are integrated on the same substrate.

20. The method of claim 19, wherein the sensing circuit is configured to sense the tip, tilt, or piston motion of the platform.

4. A method for fabricating an actuator system, the method comprising:

forming a microelectromechanical (MEMS) structure having a sacrificial layer;

forming a substrate comprising a control circuit for controlling the MEMS structure and a passivation layer for protecting the substrate, wherein the passivation layer is comprised of a patternable polymer material;

after forming the substrate, patterning and etching the passivation layer of the substrate to open a bond site on the substrate;

bonding the MEMS structure with the substrate; and

exposing the MEMS structure and the substrate to a release agent to eliminate the sacrificial layer of the MEMS structure, wherein the passivation layer protects the substrate from the release agent.

5. The method of claim 4 further comprising:

after the patterning and etching, depositing a conductive bonding agent on the bond site, wherein bonding the MEMS structure with the substrate comprises bonding the MEMS structure with the substrate at the bond site to produce a conductive bond.

6. A method for fabricating an actuator system, the method comprising:

forming a microelectromechanical (MEMS) structure having a sacrificial layer;

forming a substrate comprising a control circuit for controlling the MEMS structure and a passivation layer for protecting the substrate, wherein the passivation layer is comprised of a conductive material;

bonding the MEMS structure with the substrate;

exposing the MEMS structure and the substrate to a release agent to eliminate the sacrificial layer of the MEMS structure, wherein the passivation layer protects the substrate from the release agent; and

after exposing the MEMS structure and the substrate to the release agent, removing the passivation layer from the substrate where the substrate is not bonded to the MEMS structure.

7. The method of claim 6 wherein the passivation layer is comprised of a conductive polymer or a conductive epoxy.

8. A method for fabricating an actuator system, the method comprising:

forming a microelectromechanical (MEMS) structure having a sacrificial layer, wherein forming the MEMS structure comprises;

forming a platform connected with a set of one or more bimorph flexures; and

for each bimorph flexure in the set of bimorph flexures;

forming a first layer of the bimorph flexure, the first layer comprising a first material; and

forming a second layer of the bimorph flexure, the second layer comprising a second material, the first and second materials having substantially similar coefficients of thermal expansion (CTEs);

forming a substrate comprising a control circuit for controlling the MEMS structure and a passivation layer for protecting the substrate;

bonding the MEMS structure with the substrate; and

exposing the MEMS structure and the substrate to a release agent to eliminate the sacrificial layer of the MEMS structure, wherein the passivation layer protects the substrate from the release agent.

9. The method of claim 8, wherein the first and second materials have substantially different intrinsic residual stress (IRS) characteristics.

10. The method of claim 9 wherein exposing the MEMS structure to the release agent releases the MEMS structure and causes the set of bimorph flexures to have a curvature, the curvature of a bimorph flexure resulting substantially from the difference in IRS characteristics of the first and second materials of the bimorph flexure and not resulting substantially from the difference in the CTEs of the first and second materials of the bimorph flexure.

11. The method of claim 9, wherein the first material comprises silicon and the second material comprises silicon nitride, or the first material comprises polysilicon and the second material comprises ceramic, SiC, or silicon nitride (SixNy).

12. The method of claim 9, wherein forming the second layer comprises forming the second layer external to the first layer.

13. The method of claim 9, wherein forming the second layer comprises forming the second layer to extend over a portion of the first layer that is less than the entire length of the first layer.

14. The method of claim 9, wherein the first and second layers are formed under conditions that produce substantially different intrinsic residual stress (IRS) characteristics in the first and second materials.

15. The method of claim 14, wherein:

forming the first layer comprises tuning the residual stress of the first layer; and

forming the second layer comprises forming the second layer under a specific ratio of the reactant gasses, deposition pressure, and deposition temperature to produce a desired residual stress of the second layer.