Apparatus and methods for constructing antennas using wire bonds as radiating elements
First Claim
Patent Images
1. An antenna device, comprising:
- a substrate having first and second bond pads formed on a surface of the substrate;
an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the surface of the substrate; and
a metallic shield formed on the surface of the substrate, wherein the metallic shield is disposed between the first and second bond pads on the surface of the substrate and wherein the metallic shield is interposed between the surface of the substrate and at least a portion of the bond wire between the first and second ends thereof.
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Abstract
Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
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Citations
28 Claims
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1. An antenna device, comprising:
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a substrate having first and second bond pads formed on a surface of the substrate; an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the surface of the substrate; and a metallic shield formed on the surface of the substrate, wherein the metallic shield is disposed between the first and second bond pads on the surface of the substrate and wherein the metallic shield is interposed between the surface of the substrate and at least a portion of the bond wire between the first and second ends thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An integrated communications device, comprising:
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a IC (integrated circuit) chip having first and second bond pads formed on an active surface of the chip; an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the active surface of the IC chip; and a metallic shield formed on the active surface of the IC chip, wherein the metallic shield is disposed between the first and second bond pads on the active surface of the chip and wherein the metallic shield is interposed between the active surface of the chip and at least a portion of the bond wire between the first and second ends thereof. - View Dependent Claims (16, 17, 18)
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19. An IC (integrated circuit) package apparatus, comprising:
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a carrier substrate; an IC chip having first and second bond pads formed on an active surface of the chip and having a non-active surface mounted to the carrier substrate; an antenna comprising at least one bond wire as a radiating element, wherein the at least one bond wire has a first end bonded to the first bond pad and a second end bonded to the second bond pad on the active surface of the IC chip; a metallic shield formed on the active surface of the IC, wherein the metallic shield is disposed between the first and second bond pads on the active surface of the chip and wherein the metallic shield is interposed between the active surface of the chip and at least a portion of the bond wire between the first and second ends thereof; and a package cover that encapsulates the IC chip and antenna. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification