Method and apparatus for endpoint detection using partial least squares
First Claim
1. A method for detection of a feature etch completion, the method comprising:
- determining a correlation matrix by;
recording first measured data regarding a first etch process over successive time intervals to form a first recorded data matrix,assembling a first endpoint signal matrix using predetermined target endpoint data as an indicator of an endpoint for a specific etch process,performing a partial least squares analysis on the first recorded data matrix and the first endpoint signal matrix to refine the first recorded data matrix,computing said correlation matrix based upon the refined recorded data matrix and the first endpoint signal matrix; and
performing a second etch process to form a second recorded data matrix, wherein the correlation matrix and the second recorded data matrix are analyzed to determine whether an endpoint of the second etch process has been achieved.
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Abstract
An apparatus and method for detection of a feature etch completion within an etching reactor. The method includes determining a correlation matrix by recording first measured data regarding a first etch process over successive time intervals to form a first recorded data matrix, assembling a first endpoint signal matrix using target endpoint data for a specific etch process, performing a partial least squares analysis on the recorded data matrix and the first endpoint signal matrix to refine the recorded data matrix, and computing a correlation matrix based upon the refined recorded data matrix and the first endpoint signal matrix. The method further includes performing a second etch process to form a second recorded data matrix. The correlation matrix and the second recorded data matrix are analyzed to determine whether an endpoint of the second etch process has been achieved.
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Citations
26 Claims
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1. A method for detection of a feature etch completion, the method comprising:
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determining a correlation matrix by; recording first measured data regarding a first etch process over successive time intervals to form a first recorded data matrix, assembling a first endpoint signal matrix using predetermined target endpoint data as an indicator of an endpoint for a specific etch process, performing a partial least squares analysis on the first recorded data matrix and the first endpoint signal matrix to refine the first recorded data matrix, computing said correlation matrix based upon the refined recorded data matrix and the first endpoint signal matrix; and performing a second etch process to form a second recorded data matrix, wherein the correlation matrix and the second recorded data matrix are analyzed to determine whether an endpoint of the second etch process has been achieved. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An apparatus comprising:
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an etching reactor configured to perform an etch process therein, said etch process being driven by a power source connected to said etching reactor; an end-point detector for detecting an endpoint of said etching process, said end-point detector comprising a detecting section and a calculating section, said detecting section being configured to sequentially detect data relating to the etch process within said etching reactor, said calculating section being configured to determine a correlation matrix using first measured data regarding a first etch process over successive time intervals to form a first recorded data matrix, assemble a first endpoint signal matrix using predetermined target endpoint data as an indicator of an endpoint for a specific etch process, perform a partial least squares analysis on the first recorded data matrix and the first endpoint signal matrix to refine the first recorded data matrix, compute said correlation matrix based upon the refined recorded data matrix and the first endpoint signal matrix, and form a second recorded data matrix for a second etch process, wherein said calculating section is configured to analyze the correlation matrix and the second recorded data matrix and produce an endpoint signal when an endpoint of the second etch process has been achieved; and a controller configured to receive said endpoint signal from said calculating section, said controller being configured to control said power source based upon said endpoint signal. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification