Method for manufacturing an array of interferometric modulators

• US 7,297,471 B1
• Filed: 04/15/2003
• Issued: 11/20/2007
• Est. Priority Date: 04/15/2003
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: IDC, LLC
• Inventors: Miles, Mark W.
• Primary Examiner(s): Duda; Kathleen
• Application Number:
  US10/414,594
• Time in Patent Office: 1,680 Days
• Field of Search: 430/321
• US Class Current: 430/321
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

In one embodiment, the invention provides a method for manufacturing an array of interferometric modulators. Each interferometric modulator comprises first and second optical layers which when the interferometric modulator is in an undriven state are spaced by a gap of one size, and when the interferometric modulator is in a driven state are spaced by a gap of another size, the size of the gap determining an optical response of the interferometric modulator. The method comprises fabricating interferometric modulators of a first type characterized by the size of the gap between its first and second optical layers when in the undriven state; fabricating interferometric modulators of a second type characterized by the size of the gap between its first and second optical layers when in the undriven state; and fabricating interferometric modulators of a third type characterized by the size of the gap between its first and second optical layers when in the undriven state, wherein fabricating the interferometric modulators of the first, second, and third types comprises using a sequence of deposition and patterning steps of not more than 9 masking steps to deposit and pattern layers of material on a substrate.

Claims

1. A method for manufacturing an array of interferometric modulators, each interferometric modulator comprising first and second optical layers which when the interferometric modulator is in an undriven state are spaced by a gap of one size, and when the interferometric modulator is in a driven state are spaced by a gap of another size, the size of the gap determining an optical response of the interferometric modulator, the method comprising:

fabricating an interferometric modulator of a first type characterized by a first gap size between its first and second optical layers when in the undriven state;

fabricating an interferometric modulator of a second type characterized by a second gap size between its first and second optical layers when in the undriven state;

fabricating an interferometric modulator of a third type characterized by a third gap size between its first and second optical layers when in the undriven state,

wherein fabricating the interferometric modulators of the first, second, and third types comprises;

depositing a first sacrificial layer, the first sacrificial layer having a first thickness;

depositing a second sacrificial layer over the first sacrificial layer, the second sacrificial layer having a second thickness;

depositing a third sacrificial layer over the second sacrificial layer, the third sacrificial layer having a third thickness;

patterning at least two of the first, second, and third sacrificial layers;

wherein the first gap size is equal to or greater than a sum of the first, second, and third thicknesses;

wherein the second gap size is equal to or greater than a sum of two of the first, second, and third thicknesses; and

wherein the third gap size is equal to or greater than one of the first, second, and third thicknesses.

2. The method of claim 1, wherein the interferometric modulators of the first, second, and third types are formed in first, second, and third regions, respectively, and wherein fabricating the interferometric modulators of the first, second, and third types comprises in sequence:

depositing the first sacrificial layer in the first, second, and third regions;

removing the first sacrificial layer from the second and third regions;

depositing the second sacrificial layer in the first, second, and third regions;

removing the second sacrificial layer from the third region; and

depositing the third sacrificial layer in the first, second, and third regions.

3. The method of claim 1, wherein fabricating the interferometric modulators of the first, second, and third types further comprises removing the first, second, and third sacrificial layers after forming the first and second optical layers.

4. The method of claim 1, wherein the interferometric modulators of the first, second, and third types are formed in first, second, and third regions, respectively, and wherein fabricating the interferometric modulators of the first, second, and third types comprises in sequence:

depositing the first sacrificial layer;

depositing the second sacrificial layer over the first sacrificial layer;

depositing the third sacrificial layer over the second sacrificial layer;

removing the third sacrificial layer from the second and third regions; and

removing the second sacrificial layer from the third region.

5. The method of claim 4, wherein fabricating the interferometric modulators of the first, second, and third types further comprises:

providing a first etch stop layer between the first and second sacrificial layers; and

providing a second etch stop layer between the second and third sacrificial layers.

6. The method of claim 5, wherein the first gap size is greater than the sum of the first, second, and third thicknesses by thicknesses of the first and second etch stop layers.

7. The method of claim 4, wherein removing the third sacrificial layer from the second and third regions comprises providing a first resist over the third sacrificial layer in the first region, and etching away the third sacrificial layer, using the first resist as a mask;

and

wherein removing the second sacrificial layer from the third region comprises providing a second resist over the second sacrificial layer in the second region, and etching away the second sacrificial layer using the first and second resists as masks.

8. The method of claim 1, wherein the interferometric modulator includes a support structure which is hidden from view.

9. The method of claim 1, wherein fabricating the interferometric modulators of the first, second, and third types further comprises providing one or more etch stops between the sacrificial layers.

10. The method of claim 1, wherein the interferometric modulators of the first, second, and third types are formed in first, second, and third regions, respectively, and wherein fabricating the interferometric modulators of the first, second, and third types comprises in sequence:

depositing the first sacrificial layer;

depositing the second sacrificial layer over the first sacrificial layer;

depositing the third sacrificial layer over the second sacrificial layer;

providing a photoresist over the third sacrificial layer;

exposing the photoresist to light, using a grayscale mask;

removing the photoresist from the third region;

etching away the third sacrificial layer from the third region;

removing the photoresist from the second region; and

etching away the third sacrificial layer from the second region and the second sacrificial layer from the third region.

11. The method of claim 10, wherein the grayscale mask comprises a substantially zero transmission region overlying the first region, a moderate transmission region overlying the second region, and a highest transmission region overlying the third region, wherein the moderate transmission region has a higher transmittance than the substantially zero transmission region, and wherein the highest transmission region has a higher transmittance than the moderate transmission region.

12. The method of claim 10, wherein fabricating the interferometric modulators of the first, second, and third types further comprises:

providing an etch stop layer between the first and second sacrificial layers; and

providing an etch stop layer between the second and third sacrificial layers.

13. The method of claim 12, wherein the first, second and third sacrificial layers comprise a material etchable by XeF₂.

14. The method of claim 13, wherein the etch stop layers comprise a material etchable by XeF₂.

15. The method of claim 12, wherein the etch stop layers comprise a material etchable by XeF₂.

16. The method of claim 10, wherein the etching away of the third sacrificial layer and the second sacrificial layer comprises using dry etching.

17. The method of claim 10, wherein the etching away of the third sacrificial layer and the second sacrificial layer comprises using wet etching.