Methods and apparatus for particle reduction in MEMS devices

• US 7,297,573 B2
• Filed: 11/16/2005
• Issued: 11/20/2007
• Est. Priority Date: 05/07/2003
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: DCamp, Jon B., Curtis, Harlan L., Glenn, Max C., Dunaway, Lori A.
• Primary Examiner(s): Pham; Long
• Application Number:
  US11/280,040
• Publication Number:
  US 20060076633A1
• Time in Patent Office: 734 Days
• Field of Search: 438/108, 438/471, 438/25, 438/48, 438/58, 438/64
• US Class Current: 438/108
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 1/023 for acceleration measuring devices

Abstract

A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

Claims

1. A method for assembling a micro-electromechanical system (MEMS) device, the device including a micro-machine, said method comprising:

forming the micro-machine on a die, the die having a top surface and a bottom surface;

providing a plurality of die bonding pedestals on a surface of a housing; and

mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die is between moving components of the micro-machine and a gettering device, and at least partially shields the moving components of the micro-machine from loose gettering material.

2. A method according to claim 1 wherein said mounting comprises mounting the die such that the bottom surface of the die is between the getter and a proof mass, a motor drive comb, a motor pick-off comb, and a sense plate.

3. A method according to claim 1 further comprising providing electrical connections to the components of the micro-machine through the die bonding pedestals.

4. A method according to claim 3 further comprising providing electrical conductors from the die bonding pedestals to an exterior of the housing.

5. A method according to claim 1 wherein said mounting comprises attaching the micro-machine to the die bonding pedestals using a thermocompression bonding process.

6. A method for protecting components of a micro-machine within a housing from loose gettering material within the housing, the micro-machine formed on a die, said method comprising:

mounting a gettering device containing gettering material on the housing potion;

positioning a bottom surface of the die to at least partially shield the micro-machine components from the gettering material escaping from the gettering device; and

attaching at least one of a top surface of the die and components of the micro-machine to die bonding pedestals on a surface of the housing.

7. A method according to claim 6 further comprising providing electrical connections to the components of the micro-machine through the die bonding pedestals.

8. A method according to claim 7 further comprising providing electrical conductors from the die bonding pedestals to an exterior of the housing.

9. A method according to claim 6 wherein said mounting comprises attaching the micro-machine to the die bonding pedestals using a thermocompression bonding process.