Method of fabricating and integrating high quality decoupling capacitors
First Claim
1. Method of making an integrated capacitor, comprising:
- a) providing a first temporary support having a topside;
b) providing an oxide layer on the topside of the first temporary support to yield an oxide layer having a topside;
c) providing a first conductive layer on the topside of the oxide layer to yield a first conductive layer having a topside;
d) providing a first electrode on the first conductive layer;
e) providing a second temporary support having a topside;
f) attaching the second temporary support to the topside of the first conductive layer;
g) removing the first temporary support from the oxide layer to expose a backside of the oxide layer;
h) providing a second conductive layer on the exposed backside of the oxide layer to yield a second conductive layer having a backside;
i) providing a second electrode on the backside of the second conductive layer; and
j) the oxide layer, the first and second conductive layers, and the first and second electrodes defining a capacitor.
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Abstract
Method of making an integrated passive, such as a high quality decoupling capacitor, includes providing a first temporary support, a silicon capacitor wafer, and providing an oxide layer and a conductive layer on it. Then, a second temporary support, such as a handle wafer, may be attached to the capacitor wafer (i.e., to the oxide layer on it) by an adhesive bond. The capacitor wafer may then be destructively removed. A second conductive layer is then provided on an exposed backside of the oxide layer. The addition of a second electrode on the second conductive layer yields the desired high quality capacitor. Further processing steps, such as solder bumping, may be carried out while the capacitor wafer is still attached to the handle wafer. When the desired processing steps are complete, the handle wafer is removed, and the relatively thin high quality integrated capacitor wafer results.
28 Citations
24 Claims
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1. Method of making an integrated capacitor, comprising:
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a) providing a first temporary support having a topside; b) providing an oxide layer on the topside of the first temporary support to yield an oxide layer having a topside; c) providing a first conductive layer on the topside of the oxide layer to yield a first conductive layer having a topside; d) providing a first electrode on the first conductive layer; e) providing a second temporary support having a topside; f) attaching the second temporary support to the topside of the first conductive layer; g) removing the first temporary support from the oxide layer to expose a backside of the oxide layer; h) providing a second conductive layer on the exposed backside of the oxide layer to yield a second conductive layer having a backside; i) providing a second electrode on the backside of the second conductive layer; and j) the oxide layer, the first and second conductive layers, and the first and second electrodes defining a capacitor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification