Flexible carbon-based ohmic contacts for organic transistors
First Claim
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1. A method of forming an active device comprising acts of:
- depositing a dielectric layer on a substrate;
placing a polymer composite over at least a portion of the dielectric layer in an atmosphere to form drain and source contacts, the polymer composite having a conducting filler; and
forming an organic semiconductor layer over at least a portion of the polymer composite, the organic semiconductor layer providing a channel between the drain and source contacts.
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Abstract
The present invention relates to a system and method of organic thin-film transistors (OTFTs). More specifically, the present invention relates to employing a flexible, conductive particle-polymer composite material for ohmic contacts (i.e. drain and source).
72 Citations
27 Claims
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1. A method of forming an active device comprising acts of:
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depositing a dielectric layer on a substrate; placing a polymer composite over at least a portion of the dielectric layer in an atmosphere to form drain and source contacts, the polymer composite having a conducting filler; and forming an organic semiconductor layer over at least a portion of the polymer composite, the organic semiconductor layer providing a channel between the drain and source contacts. - View Dependent Claims (2, 3, 27)
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4. A method of forming a flexible contact comprising acts of:
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forming a first contact pattern on a supporting structure; depositing a dielectric layer on the supporting structure; depositing a polymer composite having a conducting filler to form a second contact pattern connected with the dielectric layer;
wherein the second contact pattern is deposited using a solution-based process; andproviding an organic semiconductor layer for connecting a first portion of the second contact pattern with a second portion of the second contact pattern;
wherein the organic semiconductor layer is formed using a solution-based process. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12)
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13. A flexible ohmic contact comprising:
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a supporting structure including a first contact pattern; a dielectric layer disposed on the supporting structure; a polymer composite deposited in an atmosphere and connected with the dielectric layer, the polymer composite providing a second contact pattern, the second contact pattern having a first portion and a second portion, where the first portion and the second portion are separated by a distance; and an organic semiconductor layer connected with the dielectric layer, the organic semiconductor layer allowing for an electrical connection between the first portion and the second portion of the second contact pattern. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a flexible contact comprising acts of:
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forming a first contact pattern on a supporting structure; depositing a dielectric layer on the supporting structure; depositing a polymer composite having a conducting filler to form a second contact pattern connected with the dielectric layer;
wherein the act of depositing the polymer composite is performed by a printing technique selected from;
stencil printing and inkjet printing; andproviding an organic semiconductor layer for connecting a first portion of the second contact pattern with a second portion of the second contact pattern.
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22. A method of forming a flexible contact comprising acts of:
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forming a first contact pattern on a supporting structure; depositing a dielectric layer on the supporting structure; depositing a polymer composite having a conducting filler to form a second contact pattern connected with the dielectric layer;
wherein the act of depositing the polymer composite is performed with the conducting filler selected from a group consisting of;
graphite, silver, carbon, conducting derivatives of carbon, and gold; andproviding an organic semiconductor layer for connecting a first portion of the second contact pattern with a second portion of the second contact pattern.
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23. A method of forming a flexible contact comprising acts of:
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forming a first contact pattern on a supporting structure; depositing a dielectric layer on the supporting structure; depositing a polymer composite from solution having a conducting filler to form a second contact pattern connected with the dielectric layer;
wherein the act of depositing the polymer composite is performed in an atmosphere; andproviding an organic semiconductor layer from solution for connecting a first portion of the second contact pattern with a second portion of the second contact pattern.
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24. A flexible ohmic contact comprising:
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a supporting structure including a first contact pattern; a dielectric layer disposed on the supporting structure; a polymer composite connected with the dielectric layer, the polymer composite providing a second contact pattern, the second contact pattern having a first portion and a second portion, where the first portion and the second portion are separated by a distance; and
wherein the polymer composite is a polymer thick-film ink having a conducting filler; andan organic semiconductor layer connected with the dielectric layer, the organic semiconductor layer allowing for an electrical connection between the first portion and the second portion of the second contact pattern. - View Dependent Claims (25)
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26. A flexible ohmic contact comprising:
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a supporting structure including a first contact pattern; a dielectric layer disposed on the supporting structure; a polymer composite connected with the dielectric layer, the polymer composite providing a second contact pattern, the second contact pattern having a first portion and a second portion, where the first portion and the second portion are separated by a distance; and
wherein the polymer composite is disposed with respect to the dielectric layer by stencil printing or inkjet printing; andan organic semiconductor layer connected with the dielectric layer, the organic semiconductor layer allowing for an electrical connection between the first portion and the second portion of the second contact pattern.
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Specification