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Method of making an integrated inductor

  • US 7,299,537 B2
  • Filed: 07/15/2004
  • Issued: 11/27/2007
  • Est. Priority Date: 11/23/1999
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • forming a first dielectric layer over a substrate comprising a semiconductor material;

    forming a conductor over the first dielectric layer;

    forming a second dielectric layer directly on the conductor;

    forming a magnetic layer over the second dielectric layer;

    patterning the first dielectric layer to define one or more trenches such that the conductor defines a signal path along the one or more trenches; and

    patterning the magnetic layer to define at least one slot.

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